针对目前光电印制板（OEPCB）中光电器件与光波导对接的垂直耦合结构耦合效率较低的问题, 分析了传统嵌入式45°反射微镜的垂直耦合结构, 提出了一种新的垂直耦合结构, 经Matlab仿真验证其具有更高的垂直耦合效率。研究表明, 新结构对光电对准精度要求不高, 受传统PCB制作工艺的层压的高温高压影响更小、便于兼容传统PCB制作工艺。

In present opticalelectrical printed circuit board (OEPCB), there is a problem of low coupling efficiency of the vertical coupling structure between optical electrical devices and optical waveguides. Thus in this paper, the vertical coupling structure with traditional embedded 45° reflection micro mirror was analyzed, and a new structure with higher vertical coupling efficiency was proposed and verified by simulation with Matlab. The research shows that the new structure has low requirement for opticalelectric alignment accuracy, and it is less affected by high temperature and high pressure of traditional PCB manufacturing process and is easy to be compatible with the process.