应用激光, 2018, 38 (5): 783, 网络出版: 2018-12-18  

半导体激光填丝焊工艺研究

Study on Diode Laser Wire Feeding Welding Process
作者单位
大族激光科技股份有限公司, 广东 深圳 518052
摘要
采用高功率半导体激光作为加热热源, 在不锈钢上进行填丝焊, 研究了激光功率、焊接速度、送丝速度、气流量等工艺参数对焊缝宽熔、熔深的影响。结果表明, 合理的工艺参数可以获得均匀美观的焊缝形貌。经过大量实验发现, 在激光功率P=1 800~2 300 W, 焊接速度vw=20~40 mm/s, 气体流量Q=15 L/min, 送丝速度vf=30~60 mm/s时能获得良好的焊接效果。另外与光纤激光填丝焊相比较, 半导体填丝焊焊缝更宽, 表面均匀光滑, 更适合用在装配间隙大的工件中。
Abstract
A high-power diode laser was used as a heat source to perform wire feeding on stainless steel. The influence of process parameters such as laser power, welding speed, wire feeding speed and gas flow rate on the seam width and penetration was studied. The results show that reasonable process parameters can result in uniform and beautiful weld morphology. After extensive experiments, it is found that a good weld effect can be obtained with laser power P=1 800~2 300 W, the welding speed vw=20~40 mm/s, the gas flow rate Q=15 L/min, and the wire feeding speed vf=30~60 mm/s. In addition, compared with fiber laser filler wire welding, the diode filler wire welding has a wider weld seam and a smooth and even surface, which is more suitable for use in workpiece industry with large assembly clearances.

朱宝华, 李小婷, 孙子路. 半导体激光填丝焊工艺研究[J]. 应用激光, 2018, 38(5): 783. Zhu Baohua, Li Xiaoting, Sun Zilu. Study on Diode Laser Wire Feeding Welding Process[J]. APPLIED LASER, 2018, 38(5): 783.

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