为了实现印刷电路板的短流程制作, 利用飞秒激光超短脉冲和超高峰值功率的特性, 对覆铜板进行了“选择性”和“无热影响”的刻蚀研究。利用正交试验法, 研究了平均功率、扫描速度、扫描次数、离焦量和线间距等参数对激光刻蚀质量的影响以及各参数的影响权重, 并求得最佳工艺参数。采用优化的激光参数, 可以在铜厚规格约为18 μm的覆铜板上刻蚀出深度为17.863 μm, 粗糙度为0.565 μm的底面光滑, 侧边平直且无热影响区的良好窗口, 实现表层铜完全刻蚀, 并保证环氧树脂基底的完整性。

In order to shorten the manufacturing process of PCB, considering the ultra short pulse duration and super high peek power of femtosecond laser, this laser is applied to realize the "selecting" and "no heat-affected" etching studies on copper clad laminates. The effects of femtosecond laser parameters such as average power, scanning speed, scanning times, defocusing amount and line spacing on the laser etching quality and the impact weight of each parameter are studied by orthogonal test method, and the optimal process parameters are obtained. With optimized laser parameters, a good window with a depth of 17.863 μm and a roughness of 0.565 μm with a smooth bottom surface, flat side and no heat affected zone can be etched on a copper clad laminate with a copper thickness of approx. 18 μm. The upper copper can be entirely etched and keep epoxy resin board intact.