量子电子学报, 2019, 36 (2): 248, 网络出版: 2019-04-03  

光纤复合低压电缆中光纤热致损耗仿真研究

Simulation of thermal-stain loss of optical fiber in fiber composite low voltage cable
作者单位
1 西安交通大学电气工程学院, 陕西 西安 710049
2 国网辽宁省电力有限公司, 辽宁 沈阳 110004
3 上海电缆研究所, 上海 200093
摘要
研究光纤温度与传输特性之间的关系对光纤复合低压电缆(OPLC)的设计及应用非常重要。利用COMSOL 多物理场仿真软件建立了二维仿真模型,研究了光纤轴向应力随温度的变化情况,并通过与理论计算相对比验证了模型的合理性。其次,通过理论计算得到了石英光纤的应力弹光系数,并且基于弹光效应仿真分析了涂覆层材料为丙烯酸树脂和聚乙烯两种光纤的瞬态温升特性和热致应变损耗。结果表明,涂覆层材料为丙烯酸树脂的光纤在相同时间内温度上升幅度较小,在相同温度下的损耗也更低, 40°C到250°C范围内,其热致应变损耗随温度升高而线性增加,最大值为0.033 dB/km。从瞬态温升和热致应变损耗的角度出发,涂覆层材料为丙烯酸树脂的光纤在OPLC的应用中更具优势。
Abstract
Investigation of relationship between the temperature in optical fiber and transmission characteristics is very important for the design and application of fiber composite low voltage cable(OPLC). A two-dimensional simulation model was established using COMSOL multi-physics simulation software to study the change of fiber axial stress with temperature, and the rationality of the model is verified by comparison with theoretical calculation. The stress elastic coefficient of quartz fiber was calculated theoretically and the transient temperature rise characteristics and thermal strain loss of the two kinds of optical fibers, acrylic and polyethylene, were analyzed by simulation based on the photo-elastic effect. The results show that the optical fiber with coating material of acrylic resin has smaller transient temperature rise in same time and lower loss at the same temperature. And its thermal strain loss increases linearly with increasing temperature in the range of 40°C to 250°C, with a maximum of 0.033 dB/km. From the viewpoint of transient temperature rise and thermal strain loss, the optical fiber with the coating material of acrylic resin is of more advantages in the application of OPLC.

付文成, 刘懿莹, 葛维春, 于鹏浩, 伏丽娜, 陈玉. 光纤复合低压电缆中光纤热致损耗仿真研究[J]. 量子电子学报, 2019, 36(2): 248. FU Wencheng, LIU Yiying, GE Weichun, YU Penghao, FU Lina, CHEN Yu. Simulation of thermal-stain loss of optical fiber in fiber composite low voltage cable[J]. Chinese Journal of Quantum Electronics, 2019, 36(2): 248.

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