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近紫外LED封装器件的热稳定性及可靠性

Thermal Stability and Reliability Analysis of Ultraviolet Light-emitting Diode Packages

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摘要

紫外发光二极管(紫外LED)已经在许多超越照明领域展示出了特殊的应用优势, 例如健康医疗、消毒杀菌、环保及传感等领域。本文采用仿真和实验相结合的方法研究了具有不同封装结构的近紫外LED封装器件的热稳定性, 并对其进行了高温老化可靠性测试评估。研究结果表明:LED器件的辐射功率和正向电压随温度的升高而下降, 其中, 具有倒装结构的器件下降趋势明显小于正装结构, 这表明其热稳定性较好; 经过55 ℃恒温额定电流条件下的可靠性测试发现具有倒装结构的器件光-色特性衰减速率小于正装器件。通过本文研究可以得出结论:具有低热阻、小尺寸等优点的的倒装封装结构有助于提高近紫外LED器件的光-热稳定性和可靠性。

Abstract

With many advantages, ultraviolet light-emitting diode(UV LED) packages have been widely applied in many beyond-lighting areas, including healthcare, disinfect, environmental protection and sensing. By using both simulations and experiments, this paper investigates the thermal stabilities and high temperature ageing reliability of near UV LED devices with three different packaging structures. The results indicate that, the radiation power and forward voltage of all samples show a downward trend with the increase of substrate temperature, but the downward trend of UV LED with flip-chip packaging structure is significantly less than that of wire bonding UV LEDs; the reliability test under the 55 ℃ and constant rated current condition shows that the luminous flux, radiation power and color coordinate of flip-chip type UV LEDs are relatively stable than those of wire-bonding type UV LEDs. Generally, this study can conclude that the flip-chip packaging structure with lower thermal resistance, small size and long life can improve the optical and thermal stabilities and reliability of UV LEDs.

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中图分类号:TN312.8

DOI:10.3788/fgxb20194007.0871

所属栏目:器件制备及器件物理

基金项目:国家自然科学基金(51805147); 江苏省“六大人才高峰”项目(GDZB-017); 国家国际科技合作专项(2015DFT10110); 中央高校基本科研业务费专项资金(2017B15014)资助项目

收稿日期:2018-07-17

修改稿日期:2018-10-18

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樊嘉杰:河海大学 机电工程学院, 江苏 常州 213022常州市武进区半导体照明应用技术研究院, 江苏 常州 213161
曹建武:河海大学 机电工程学院, 江苏 常州 213022常州市武进区半导体照明应用技术研究院, 江苏 常州 213161
刘 杰:河海大学 机电工程学院, 江苏 常州 213022
经 周:河海大学 机电工程学院, 江苏 常州 213022
孙 博:广东工业大学 电子信息工程学院, 广东 广州 510006
胡爱华:福建鸿博光电科技有限公司, 福建 福州 350008

联系人作者:樊嘉杰(jiajie.fan@hhu.edu.cn)

备注:樊嘉杰(1983-), 男, 江苏常州人, 博士, 副教授, 2014年于香港理工大学获得博士学位, 主要从事机械电子器件及系统故障诊断和预测、半导体照明系统可靠性评估、第三代半导体封装及组装工艺等的研究。

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引用该论文

FAN Jia-jie,CAO Jian-wu,LIU Jie,JING Zhou,SUN Bo,HU Ai-hua. Thermal Stability and Reliability Analysis of Ultraviolet Light-emitting Diode Packages[J]. Chinese Journal of Luminescence, 2019, 40(7): 871-878

樊嘉杰,曹建武,刘 杰,经 周,孙 博,胡爱华. 近紫外LED封装器件的热稳定性及可靠性[J]. 发光学报, 2019, 40(7): 871-878

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