为解决无热模块的小型化封装问题，针对现有的 2种无热补偿方案的研究提出了一种新型的基于双金属片和金属板双重补偿的阵列波导光栅（AWG）温度补偿结构。理论计算结果表明：该结构能够实现波长漂移 的温度补偿，并使金属板的长度缩小为位移无热补偿型的 14，实现模块小型化封装，通过调整双金属片的厚度、宽度以及金属板的长度来适应 AWG芯片的波长漂移量，提高了设计的灵活性。

According to the study of two existing athermal compensation scheme s, a new athermal arrayed waveguide gratings (AWG）temperature compensation structure has been presented to solve the problem of miniaturized packaging of athermal module in this paper, which is based on the bimetallic strip and the me tal plate. The theoretical calculation results show that linear wavelength shift can be completely compensated. In addition, the length of the metal plate was reduced to 1/4 of the original one, enabling the module to be miniaturized. This structure can adapt to the wavelength shift of the AWG chip by adjusting the thickness, width of the bimetal, and the length of the metal plate, which improves the design flexibility.