为了减小约束投影快速3D打印工艺中黏附力对工艺可靠性及打印速度的影响, 提出了一种多孔透明支撑板+PDMS膜低成本实现阻聚区的方案, 并围绕阻聚区形成的两个关键因素-基底透光性和气体渗透性及其影响阻聚区和黏附力的规律进行研究。通过激光加工方法制备了具有微孔阵列的石英玻璃基底, 通过对基底透光性、透氧性以及氧阻聚区厚度的实验测量, 研究了基底微观几何特征及光照强度、氧气浓度等工艺要素对阻聚区厚度的影响规律, 并通过3D打印试验, 初步研究了不同基底条件下固化层在基底的黏附力。结果表明, 基底微孔影响基底的透光率以及透氧性能, 所制备的具有不同几何特征微孔的基底透光率均大于84%; 通过调控氧浓度、光照强度以及基底微结构特征可以控制氧阻聚区的厚度; 基底及供氧条件影响阻聚区的厚度从而影响剥离力。采用本文制备的约束基底打印零件过程中可以形成阻聚区, 从而显著减小剥离力, 在本文的实验条件下, 固化层从基底的平均剥离力由26.4 N降至5.4 N。

To reduce the influence of adhesion on the process reliability and printing speed in constrained projection fast 3D printing processes. A low-cost constrained substrate scheme was presented with porous transparent support plate and PDMS film for inhibition zone realization. It focused on substrate light transmittance and gas permeability and their influence on the inhibition zone formation and adhesion. The quartz glass substrate with a microporous array was prepared using a laser processing method. The light transmittance, oxygen permeability of the substrate, and thickness of the oxygen inhibition zone were measured experimentally. The influence of the microscopic geometrical characteristics of the substrate on the light transmittance, oxygen permeability, and oxygen inhibition thickness was investigated. 3D printing experiments and a preliminary investigation of the adhesion of the cured layer on the substrate under different substrate conditions were conducted. The results indicate that the micro-pores on the substrate affect the light transmittance and oxygen permeability. The transmittance of the prepared micropores with different geometric features is found to be greater than 84%.The thickness of the oxygen inhibition zone can be controlled by adjusting the oxygen concentration, light intensity, and microstructure of the substrate. The oxygen supply conditions of the substrate affect the thickness of the inhibition zone and subsequently the cued layer peeling force. Adopting the prepared constrained substrateenables the formation of the inhibition layer during printing of the parts and significantly reduces peeling force.The average peeling force of the cured layer from the substrate reduces from 26.4 N to 5.4 N under the experimental conditions in this study.