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激光剥离技术在柔性电子制造领域的应用研究进展 (封面文章)

Application of Laser Lift-off Technique in Flexible Electronics Manufacturing (Cover Paper)

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摘要

激光剥离技术通过脉冲激光辐照致材料烧蚀实现器件向终端基底的转移,具有一定的材料适用性和工艺兼容性,已成为近年来柔性电子器件制造的新兴关键技术。从激光剥离技术的基本机制和工艺特点出发,对激光剥离技术在不同柔性电子器件制造中的研究现状进行调研和介绍,重点阐述激光剥离技术应用中的新工艺与新理论。对激光剥离技术今后的发展方向,特别是超快激光在技术中的应用可能性进行了总结和展望。

Abstract

Laser lift-off (LLO) is a technique used to transfer devices to terminal substrates through the ablation of materials by pulsed laser irradiation. Recently, LLO has become the major technique for the fabrication of flexible electronic devices because of its wide material applicability and process compatibility. Further, the representative research achievements of LLO in case of the fabrication of flexible electronics are investigated and presented in this study with respect to the basic mechanisms and technological features, and novel theories and application techniques are given particular emphasis. Accordingly, the application prospects of the LLO technique, especially the possibility of ultrafast laser applications, are summarized and forecasted.

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中图分类号:TN249

DOI:10.3788/CJL202047.0100001

所属栏目:综述

基金项目:国家重点研发计划、国家自然科学基金;

收稿日期:2019-07-22

修改稿日期:2019-09-03

网络出版日期:2020-01-01

作者单位    点击查看

季凌飞:北京工业大学激光工程研究院, 北京 100124跨尺度激光成型制造技术教育部重点实验室, 北京 100124
马瑞:北京工业大学激光工程研究院, 北京 100124跨尺度激光成型制造技术教育部重点实验室, 北京 100124
张熙民:北京工业大学激光工程研究院, 北京 100124跨尺度激光成型制造技术教育部重点实验室, 北京 100124
孙正阳:北京工业大学激光工程研究院, 北京 100124跨尺度激光成型制造技术教育部重点实验室, 北京 100124
李鑫:北京工业大学激光工程研究院, 北京 100124跨尺度激光成型制造技术教育部重点实验室, 北京 100124

联系人作者:季凌飞(ncltji@bjut.edu.cn)

备注:国家重点研发计划、国家自然科学基金;

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引用该论文

Ji Lingfei,Ma Rui,Zhang Ximin,Sun Zhengyang,Li Xin. Application of Laser Lift-off Technique in Flexible Electronics Manufacturing[J]. Chinese Journal of Lasers, 2020, 47(1): 0100001

季凌飞,马瑞,张熙民,孙正阳,李鑫. 激光剥离技术在柔性电子制造领域的应用研究进展[J]. 中国激光, 2020, 47(1): 0100001

被引情况

【1】岳武,龚成功,张俊喜,包莹,李晶,冯毅. 激光喷射锡球键合微焊点溅射缺陷分析. 中国激光, 2020, 47(8): 802010--1

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