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激光剥离技术在柔性电子制造领域的应用研究进展 (封面文章)

Application of Laser Lift-off Technique in Flexible Electronics Manufacturing (Cover Paper)

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Laser lift-off (LLO) is a technique used to transfer devices to terminal substrates through the ablation of materials by pulsed laser irradiation. Recently, LLO has become the major technique for the fabrication of flexible electronic devices because of its wide material applicability and process compatibility. Further, the representative research achievements of LLO in case of the fabrication of flexible electronics are investigated and presented in this study with respect to the basic mechanisms and technological features, and novel theories and application techniques are given particular emphasis. Accordingly, the application prospects of the LLO technique, especially the possibility of ultrafast laser applications, are summarized and forecasted.

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季凌飞:北京工业大学激光工程研究院, 北京 100124跨尺度激光成型制造技术教育部重点实验室, 北京 100124
马瑞:北京工业大学激光工程研究院, 北京 100124跨尺度激光成型制造技术教育部重点实验室, 北京 100124
张熙民:北京工业大学激光工程研究院, 北京 100124跨尺度激光成型制造技术教育部重点实验室, 北京 100124
孙正阳:北京工业大学激光工程研究院, 北京 100124跨尺度激光成型制造技术教育部重点实验室, 北京 100124
李鑫:北京工业大学激光工程研究院, 北京 100124跨尺度激光成型制造技术教育部重点实验室, 北京 100124



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Ji Lingfei,Ma Rui,Zhang Ximin,Sun Zhengyang,Li Xin. Application of Laser Lift-off Technique in Flexible Electronics Manufacturing[J]. Chinese Journal of Lasers, 2020, 47(1): 0100001

季凌飞,马瑞,张熙民,孙正阳,李鑫. 激光剥离技术在柔性电子制造领域的应用研究进展[J]. 中国激光, 2020, 47(1): 0100001


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