针对传统电路板集成方式的局限性,提出基于飞秒激光的覆铜板线路成形技术。采用飞秒激光对覆铜板进行单因素实验和正交实验,结果表明,在激光功率、频率、扫描速度、扫描次数以及离焦量等因素中,扫描次数对刻蚀深度和表面粗糙度的影响最大,激光频率的影响最小;采用优化后的激光参数进行刻蚀,可以将表面铜层完全除去,得到高质量的刻蚀区域而不伤及底层基材。

With the aim of overcoming the limitations of traditional circuit-board integration methods, a copper-clad board-line forming technology based on femtosecond laser is proposed. Single-factor and orthogonal experiments are performed on a copper-clad laminate using femtosecond laser. Among influencing factors such as laser power, frequency, scanning speed, number of scans, and defocusing amount, the number of scans has the largest influence on the etching depth and surface roughness, while the laser frequency has the smallest influence on both. By etching the copper-clad laminate with optimized laser parameters, the surface copper layer can be removed completely to obtain a high-quality etched region without damaging the substrate underneath.