通过对高导无氧（OFHC）铜的激光喷丸强化（LSP）过程进行数值模拟，研究了重复喷丸次数对LSP的残余应力场和凹坑的影响，并着重探讨了残余应力强化机理。结果表明，随着重复喷丸次数的增加，靶材的塑性变形和凹坑深度逐渐增大，残余压应力与靶材的流动应力均表现出趋于饱和的态势。相对于第三和第四次重复LSP，第二次重复LSP对残余应力大小与分布的影响最为显著。重复多次LSP后的残余压应力强化主要源自材料的硬化历史，前次LSP产生的残余应力对当前LSP过程的靶材硬化有一定抑制作用。

Based on the numerical simulation of laser shock peening (LSP) process of oxygen-free high-conductivity (OFHC) copper, the effect of numbers of repetitive peens on the residual stress field and the dimple in the LSP process is studied, and the mechanism of strengthening residual stress is discussed emphatically. The numerical results show that, with the increase of numbers of repetitive peens, both the plastic deformation of target materials and the dimple depth increase, and both the residual stress and the flow stress of target materials gradually approach to saturation. Compared with those by the third or fourth LSP, the influence on the size and distribution of the residual stress induced by the second LSP is more significant. The strengthening of the residual stress after repetitive LSPs is mainly attributed to the hardening history of target materials, and the residual stress induced by the previous LSP shows certain inhibition effect on the material hardening in the current LSP process.