毫秒和纳秒激光以其高可靠、高效率、低成本和可加工硬脆难加工材料的独特优势,成为加工氧化铝和氮化铝陶瓷的首选,在电子陶瓷基板表面孔的工业化加工中具有不可替代的作用。介绍了毫秒和纳秒激光加工作为电子基板的陶瓷材料的去除机理,如材料烧蚀阈值、光热作用和光化学作用等,讨论了毫秒和纳秒激光加工参数、加工环境等因素对陶瓷材料表面孔加工尺寸(如直径、深度和锥度等)的影响规律,总结了目前陶瓷基板表面激光孔加工工业化应用面临的问题,并对其未来的发展方向进行了展望。

Millisecond and nanosecond lasers have become the preferred processing tools for alumina and aluminum nitride ceramics owing to the lasers' unique advantages of high reliability, high efficiency, low cost, and ability to process hard, brittle, and difficult-to-machine materials. These lasers play an irreplaceable role in the industrialized processing of group holes on ceramic substrate surfaces. This paper introduces the removal mechanisms with respect to laser processing ceramic materials of electronic substrates, including material ablation threshold, photothermal effect, and photochemical effect. The effects of the lasers' processing parameters and ambient environments on the hole size of ceramic materials, such as diameter, depth, and taper, are discussed. Current problems in the industrial application of laser hole drilling to ceramic substrates are summarized, and future development trends are presented.