高功率半导体激光器陶瓷封装散热性能研究
倪羽茜, 井红旗, 孔金霞, 祁琼, 刘素平, 马骁宇. 高功率半导体激光器陶瓷封装散热性能研究[J]. 发光学报, 2016, 37(5): 561.
NI Yu-xi, JING Hong-qi*, KONG Jin-xia, QI Qiong, LIU Su-ping, MA Xiao-yu. Thermal Performance of High-power Semiconductor Laser Packaged by Ceramic Submount[J]. Chinese Journal of Luminescence, 2016, 37(5): 561.
[1] PETRESCU-PRAHOVA I B, MODAK P, GOUTAIN E, et al.. 253 mW/μm maximum power density from 9×× nm epitaxial laser structures with d/Γ greater than 1 μm [C]. Proceedings of The IEEE 21st International: Semiconductor Laser Conference, Sorrento, Italy, 2008:135-136.
[2] ZUCKER E, ZOU D, ZAVALA L, et al.. Advancements in laser diode chip and packaging technologies for application in kW-class fiber laser pumping [C]. Proceedings of SPIE 8965, High-Power Diode Laser Technology and Applications XII, San Francisco, USA, 2014:8965.
[3] CRUMP P, BLUME G, PASCHKE K, et al.. 20 W continuous wave reliable operation of 980 nm broad-area single emitter diode lasers with an aperture of 96 μm [C]. Proceedings of SPIE 7198, High-Power Diode Laser Technology and Applications VII, San Jose, USA, 2009:7198.
[4] CRUMP P, ERBERT G, WENZEL H, et al.. Efficient high-power laser diodes [J]. IEEE J. Sel. Top. Quant. Electron., 2013, 19(4):1501211.
[6] ADACHI S, CAPPER P, KASAP S, et al.. Properties of Semiconductor Alloys: Group-Ⅳ, Ⅲ-Ⅴ and Ⅱ-Ⅵ Semiconduc-tors [M]. Chichester: John Wiley & Sons, 2009.
[7] SZYMAN'SKI M, KOZLOWSKA A, MALAG A, et al.. Two-dimensional model of heat flow in broad-area laser diode mounted to a non-ideal heat sink [J]. J. Phys. D: Appl. Phys., 2007, 40(3):924-929.
[8] JING H Q, ZHONG L, NI Y X, et al.. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics [J]. J. Semicond., 2015, 36(10):102006.
[9] LIU Y, LEUNG S Y Y, WONG C K Y, et al.. Thermal simulation of flexible LED package enhanced with copper pillars [J]. J. Semicond., 2015, 36(6):064011.
[11] SZYMANSKI M, ZBROSZCZYK M, MROZIEWICZ B. The influence of different heat sources on temperature distributions in broad-area diode lasers [C]. Proceedings of SPIE 5582, Advanced Optoelectronics and Lasers, San Francisco, USA, 2004:5582.
[12] VIKHRENKO V. Heat Transfer-Engineering Applications [M]. Rijeka: Intech, 2011.
倪羽茜, 井红旗, 孔金霞, 祁琼, 刘素平, 马骁宇. 高功率半导体激光器陶瓷封装散热性能研究[J]. 发光学报, 2016, 37(5): 561. NI Yu-xi, JING Hong-qi*, KONG Jin-xia, QI Qiong, LIU Su-ping, MA Xiao-yu. Thermal Performance of High-power Semiconductor Laser Packaged by Ceramic Submount[J]. Chinese Journal of Luminescence, 2016, 37(5): 561.