为探索三维现场可编程门阵列 (FPGA)芯片温度的影响因素，提出一种三维 FPGA有限元仿真模型。首先，利用商业有限元软件构建基于硅通孔 (TSV)、微凸块、倒装焊共晶焊球、无源硅中介层、焊球阵列( BGA)焊球和印制电路板( PCB)的模型。然后，利用该模型从定性和定量的角度对不同 TSV数目及堆叠层数的三维 FPGA芯片进行温度分析。实验发现，底层芯片到顶层芯片的平均温度呈递增趋势，且各层芯片的平均温度随 TSV数目的减少和堆叠层数的增加而升高。实验结果与已发表文献中的结果一致，表明提出的仿真模型在分析芯片温度的影响参数方面的可行性。

To explore the factors affecting the temperature of the three dimensional FieldProgrammable Gate Array(FPGA) chip， a finite element simulation model targeted three dimensional FPGA is proposed. First，the model is constructed using commercial software Flotherm based on Through Silicon Via(TSV)，micro bump，flip chip eutectic bump，interposer，Ball Grid Array(BGA) solder ball and PCB.Then，the model is adopted to analyze the temperature of the three dimensional FPGA chip with different numbers of TSVs and stacking layers from qualitative and quantitative point of view. It is found that the average temperature increases from the bottom chip to the top chip，and the average temperature of each layer increases with the decrease of the number of TSVs and the increase of the number of stacking layers. The experimental results are consistent with the results published in the literature, indicating the feasibility of the proposed simulation model in the analysis of the parameters influencing the temperature of the chip.