半导体光电, 2017, 38 (4): 551, 网络出版: 2017-08-30  

一种基于0.18μm CMOS工艺的智能传感器网络节点设计与实现

Design and Implementation of a Smart Sensor Network Node for 0.18μm CMOS Process
作者单位
潍坊科技学院 中印计算机软件学院, 山东 寿光 262700
摘要
针对当前无线监测网络节点存在无线通信距离小、数据传输周期短等问题, 设计并实现了一种基于0.18μm CMOS工艺的智能传感器网络节点。该无线传感器网络节点由无线传感器模块、CC2430处理器模块、无线通信模块以及电源模块构成。其中, CC2430处理器模块采用0.18μm CMOS工艺控制电流损耗和模式变换时间, 提高电源的运行周期, 并采用0.18μm CMOS工艺中低噪声放大器和UQ下变频对天线采集的射频信号进行操作, 获取2.4GHz的数据扩频, 增强CC2420的无线通信抗干扰性能。设计了无线传感器网络节点中的SHTIO温湿度传感器、MS5534B集成压阻式压力传感器和ADXL202E双轴加速度传感器, 并给出节点软件的结构和主程序流程。实验检测结果表明, 设计的无线传感器网络具备较优的运行性能, 丢包率较低, 通信距离与运行周期明显优于传统方法。
Abstract
In view of the problems of small wireless communication distance, short data transmission cycle etc. in the current wireless monitoring network node, a smart sensor network nodes based on 0.18μm CMOS processed has been designed and implemented in this paper. The wireless sensor network node consists of a wireless sensor module, a CC2430 processor module, a wireless communication module and a power supply module. The CC2430 processor module which uses 0.18m CMOS process controls the current loss and mode conversion time to improve the power cycle, and the low noise amplifier and UQ down conversion operate on the RF signals collected by the antenna, access to 2.4GHz of the data spread spectrum, enhance the wireless communication anti-jamming performance of CC2420. The SHTIO temperature and humidity sensor, MS5534B integrated piezoresistive pressure sensor and the ADXL202E biaxial acceleration sensor in the wireless sensor network node are designed, and the structure and main program flow of the node software are also given. The experimental results show that the wireless sensor network designed in this paper has better running performance, low packet loss rate, and the communication distance and running cycle is superior to the traditional method.

王冬波. 一种基于0.18μm CMOS工艺的智能传感器网络节点设计与实现[J]. 半导体光电, 2017, 38(4): 551. WANG Dongbo. Design and Implementation of a Smart Sensor Network Node for 0.18μm CMOS Process[J]. Semiconductor Optoelectronics, 2017, 38(4): 551.

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