光子学报, 2017, 46 (9): 0914001, 网络出版: 2017-10-16   

传导冷却单巴高功率半导体激光器热应力和smile研究

Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays
作者单位
1 中国科学院西安光学精密机械研究所 瞬态光学与光子技术重点实验室,西安 710119
2 中国科学院大学,北京100049
3 西安炬光科技股份有限公司,西安710077
摘要
利用有限元模型分别研究了回流过程和工作过程中传导冷却高功率半导体激光器的正应力、切应力和形变,并借助理论公式分析了热应力和smile的产生原因和分布规律.分析表明,在回流过程中热膨胀系数不匹配造成的切应力是正应力和变形的根源,而在工作过程中,热膨胀系数不匹配和温度梯度共同影响着热应力和变形.在此基础上,将回流导致的剩余应力和变形作为初始条件施加在有限元模型上,对工作状态器件的热应力和smile进行模拟,以获得更精确的模拟结果.最后,通过有限元模型和实验手段研究了不同热沉温度对 smile 的影响.结果表明,工作过程会导致器件的smile增大,热沉温度的升高也会造成smile进一步增大.
Abstract
Finite element analysis model of the conduction-cooled package high power semiconductor lasers were established respectively to analyze normal stress, shear stress and displacement in reflowing process and operating process independently. With the help of analytical solution model, the cause and the distribution of thermal stress and smile were analyzed. The results show that shear stress is the origin of other thermo-mechanical behavior in reflowing process due to coefficient thermal expansion mismatch, while both coefficient thermal expansion mismatch and temperature gradient affect the thermal stress and displacement in operating process. In order to obtain the accurate result, the residual stress and displacement of reflowing process were considered as the initial condition in operating finite element analysis simulation, and the thermal stress and smile were simulated. The influence of heat sink temperature on smile was studied with finite element analysis and experiment. The result shows operating process has great impact on smile and results in worse smile, and with the rising of temperature of heat sink, smile also becomes larger.

鲁瑶, 聂志强, 陈天奇, 张普, 熊玲玲, 吴的海, 李小宁, 王贞福, 刘兴胜. 传导冷却单巴高功率半导体激光器热应力和smile研究[J]. 光子学报, 2017, 46(9): 0914001. LU Yao, NIE Zhi-qiang, CHEN Tian-qi, ZHANG pu, XIONG Ling-ling, WU Di-hai, LI Xiao-ning, WANG Zhen-fu, LIU Xing-sheng. Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays[J]. ACTA PHOTONICA SINICA, 2017, 46(9): 0914001.

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