从Total Pitch(TP)的理论含义与监控原理出发, 通过对相同Device下Pitch量和TP 测试Mark的更改, 讨论了X方向以及Y方向TP的变化。通过相同Lay out不同产品和相同产品不同Lay out的对比, 发现TP并不随着Pitch量的改变而变化, 但设备扭曲度(Distortion)影响着TP的变化, 由此TP也可称为Distortion在实际生产中的简化监测点, 并且得到TP从NG到OK变化的pitch量区间, 这也为降低图形在基板上的扭曲程度和优化Mask设计提供了新思路。

Based on the theories and monitoring principle of Total Pitch (TP), we discussed the X direction and Y direction variation of TP, which changed by pitch value and TP measurement mark. By contrasting the same lay out but different product with the same product but different lay out, we found that TP does not change with the variation of pitch value. However, distortion affects the variation of TP, which can also be called a simplified monitoring points of distortion in the actual process. The acquisition of the interval of TP from NG to OK provides a new idea of optimizing mask design and reducing the distortion of graphics on the glass.