红外技术, 2017, 39 (9): 841, 网络出版: 2017-12-04
16位高精度在线式红外热像仪的技术方案与实现
Online Temperature Measurement Technology Solutions and Implementation of 16 bit Infrared Thermal Imager
红外热成像 在线非接触测温 16 bit 精度 infrared thermal imaging on-line non-contact temperature measurement 16 bit accuracy
摘要
为了红外热像仪易于产品化、国产化,提出了一套非接触在线测温的整体技术方案。该技术方案主要利用Flir 的TauII 机芯和达芬奇ARM+DSP 双核视频处理器DM6446 两大主要器件,经二次开发后的视频驱动程序使DSP 的CCD 视频接口能直接驱动Flir 机芯的CMOS 接口,改进后的RTSP 协议进行红外热图的网络传输。与国内外同类方案相比,省却了FPGA 进行电平信号转换的环节,也无需视频解码芯片,从而使方案精简和低成本。经比较抓拍测试模式下的raw 格式文件,与Flir 原装整机所拍效果完全相同,标定后的拟合方程近似线性完全满足测温要求,可以推广量产,加速摆脱红外热像仪对进口的依赖。
Abstract
An integral technological solution that realizes non-contact online temperature measurement is proposed based on the principle of infrared thermal imaging to facilitate easy productization and localization of infrared thermal imager. This solution utilizes FLIR's Tau II module and the Davinci DM6446 ARM+ DSP processor as the two main components. The DSP CCD video interface driven by a customized video driver program can directly drive the CMOS interface of the FLIR module. An improved RTP/RTSP protocol can transfer the data of an infrared thermal image through a network. Compared with other similar solutions, the conversion of signal level and image preprocessing in the FPGA circuit are skipped and a video encoder chip is unnecessary. Owing to these advantages, the solutions are simple and low-cost and consequently, easy for production. Using the snapping same logo test, upon comparing raw-format files obtained from the FLIR module, the picture qualities are observed to be similar. After calibration, the temperature curve approximates to a linear fitting equation, which satisfies the requirement of temperature measurement. Therefore, this solution can promote mass production and enable the elimination of the dependence of infrared thermal imager on imports.
丁德红. 16位高精度在线式红外热像仪的技术方案与实现[J]. 红外技术, 2017, 39(9): 841. DING Dehong. Online Temperature Measurement Technology Solutions and Implementation of 16 bit Infrared Thermal Imager[J]. Infrared Technology, 2017, 39(9): 841.