光电工程, 2017, 44 (12): 1169, 网络出版: 2018-01-17
紫外激光器及其在微加工中的应用
Review of UV laser and its applications in micromachining
紫外激光器 激光微加工 半导体材料 微光学元件 聚合物 UV laser laser micromachining semiconductor micro-optical element polymer
摘要
紫外激光以其波长短、加工精度高、冷加工等特性,在微细制造中具有独特优势,能够有效提高制造品质。近年来,随着现代电子产业的快速发展,其对生产制造的要求不断提高,紫外激光的应用和发展也受到人们的广泛关注。紫外激光在微加工过程中对材料尺寸形状要求小,加工过程灵活可变,产生的热影响区小,能够实现精密复杂结构的加工。本文介绍了紫外激光器的发展过程,并对目前主要用于微加工的两类紫外激光器:准分子激光器和全固态激光器的工作原理和技术特点进行了简要的概述。重点讨论紫外激光在半导体、光学元件和聚合物等领域的技术发展和应用现状,并进一步对未来研究方向进行预测和展望。
Abstract
Ultraviolet (UV) laser has unique advantages in micromachining due to short wavelength, high ma-chining accuracy and cold processing property, leading to improve manufacturing quality effectively. In recent years, electronic industry has been developed rapidly and needs high fabrication requirements. Progress of UV laser has attracted much attention in applications of electronic industry because it can produce complex struc-tures on almost any materials with flexible process and small heat-affected zone. In this review, we summarize the history of UV laser development and fundamental principles as well as characteristics of excimer laser and diode pumped solid state laser, which are two major UV lasers used for micromachining. Moreover, we analyze the development and applications of UV laser in micromachining of semiconductor, optical element and polymer. Finally, we propose some prospects for further research and development in UV laser and its applications.
聂世琳, 管迎春. 紫外激光器及其在微加工中的应用[J]. 光电工程, 2017, 44(12): 1169. Shilin Nie, Yingchun Guan. Review of UV laser and its applications in micromachining[J]. Opto-Electronic Engineering, 2017, 44(12): 1169.