云计算、大数据等互联网应用导致通信流量快速增长，第五代移动通信的到来会进一步加快这一趋势。为了满足大容量、高端口密度、低功耗数据中心互连以及城域网应用的要求，100 Gbit/s光模块从外形封装可插拔(CFP)模块演变到CFP2又演变到四通道小型化可插拔(QSFP)模块。光模块尺寸和功耗的降低对光发射组件提出了更高要求。因此采用混合集成封装技术减小光发射组件的尺寸、降低功耗和成本是未来的发展方向。文章介绍了目前研发的QSFP 28封装100 Gbit/s混合集成电吸收调制激光器光发射组件所采用的关键技术，给出了符合100 G BASE-LR4国际标准的工作眼图，并就未来光发射组件的发展方向做出了展望。

Recently, owing to the thriving business of internet applications, such as cloud computing and big data, communication traffic is growing rapidly. The fifth generation mobile communication technology will also further accelerate this trend. In order to satisfy the need of high capacity, high terminal density, lower power dissipation of data center interconnectivity and the need of metropolitan area network application, 100 Gbit/s optical module has evolved from Centum Form-factor Pluggable (CFP) to CFP2 and further to Quad Small Form-factor Pluggable (QSFP). The reduction in size and power dissipation of the optical module is a greater challenge to transmitter optical sub-assembly. Therefore, adopting hybrid-integrated packaging technology is the future direction for Transmitter Optical Sub-Assembly (TOSA) packaging, which can not only reduce the size of TOSA, but its power dissipation and cost as well. In this article, we introduce a QSFP28 100 Gbit/s hybrid-integrated Electro-absorption Modulated Laser (EML) TOSA, including its core technology, and show four eye diagrams that are up to the standard of 100 G BASE-LR4. Finally, a brief prediction of the future development of TOSA is made.