建立了光模块三维模型, 通过有限元仿真分析了器件工作时的温度分布特性。结果表明, 屏蔽罩的存在阻挡了芯片换热, 影响了芯片的散热效率; 利用红外摄像机观测芯片的工作温度, 并与仿真结果进行对比, 验证了仿真结果的准确性。根据分析结论, 提出了改进屏蔽罩结构以提高对流换热效率的优化设计措施。仿真结果表明此方法具有可行性, 对光模块产品的结构设计与优化具有实际意义。

The three-dimensional model of the optical module was established, and fnite element simulation was carried out to reveal the temperature distribution of the device. The results show that the shield cage obstructs the heat convection of the chip and affects adversely the heat dissipation efficiency. The infrared camera was used to observe the chips working temperature distribution, thus the simulation results were verified. Based on the conclusions, an optimal design of optical module was proposed to improve the convection efficiency by modifying the structure of shield cage and the simulation results proved the feasibility of this method, providing practical significance for the design and optimization of optical module products.