太赫兹科学与电子信息学报, 2018, 16 (2): 330, 网络出版: 2018-06-09
基于场路协同分析的射频SiP EMC
Investigation on EMC of RF-SiP based on field-circuit cooperated analysis
场路协同分析 系统级封装 电磁兼容 耦合度 field-circuit cooperated analysis System in Package Electro-Magnetic Compatibility co-infection
摘要
在现代高密度集成设计的标准下, 场路协同分析法以其高效而精准的电磁兼容 (EMC)分析能力, 广泛用于系统级封装 (SiP)技术设计中。基于网络散射参数理论, 建立场路协同分析法的等效模型, 分析其工作原理, 并以射频 SiP中放大器表贴芯片的应用为例, 从 Matlab理论计算与模型仿真的角度, 验证模型的准确性。进一步针对大功率射频 (RF)器件集成中 EMC问题进行研究, 发现通过改变互连结构自身因素, 如改变互连线的长度、形状、间距等, 或通过改变外在因素, 如改变腔体大小、添加隔条、调节互连结构的位置等, 可改变单元结构间的耦合情况, 从而规避强耦合、自激等 EMC问题, 大幅提高系统的性能。
Abstract
Under the modern high density integration design standard, field-circuit cooperated analysis method with the efficient and accurate Electro-Magnetic Compatibility(EMC) analysis ability, is widely applied in the System in Package(SiP) technology design. Based on the theory of network scattering parameters, equivalent model for field-circuit cooperated analysis method is built. After theoretical analysis for its working principle, the radio frequency surface mount amplifier layout is taken as an example to verify the model’s accuracy by means of Matlab theoretical calculation and model simulation. And then the EMC issues of the high power Radio Frequency(RF) devices integration are investigated. It is found that the electromagnetic coupling can be reduced through changing itself factors of interconnection structure, for example, changing the length, shape, distance, or changing external factors, such as adjusting the cavity resonance, the position of the interconnection. As a result, the EMC issues, like strong coupling, self excitation, can be avoided, and the performance of the system is improved greatly.
李照荣, 吕立明, 万里兮, 曾荣. 基于场路协同分析的射频SiP EMC[J]. 太赫兹科学与电子信息学报, 2018, 16(2): 330. LI Zhaorong, LYU Liming, WAN Lixi, ZENG Rong. Investigation on EMC of RF-SiP based on field-circuit cooperated analysis[J]. Journal of terahertz science and electronic information technology, 2018, 16(2): 330.