从高像素填充因子、低噪声、高帧频、高空间分辨率及柔性五个方面对近些年X射线平板探测器背板工艺的研究进展进行了综述。通过对研究过程中的材料选择、像素结构和读出电路优化的详细阐述, 分析了X射线平板探测器背板工艺的研究现状及改善方向。文章同时从新结构、新材料、电路设计及三维探测设计四个方面给出了X射线平板探测背板技术未来的发展趋势。

The recent progresses of the backplane technology of Xray flat panel detector are reviewed, and the reasearch status of such indexes as high pixel fill factor, low noise, high frame rate, high spatial resolution and flexibility are discussed from the aspects of material, pixel structure, readout circuit and so on. The future trends are also put forward for backplane technology of Xray flat panel detectors.