为了提高压电驱动芯片水冷系统的适用性、可维护性以及冷却效率, 本文提出一种组合式压电驱动芯片水冷系统。首先, 测试和分析了芯片水冷系统中组合式泵单元在220 Vpp方波驱动下不同组合方式(串/并联)、泵工作数量以及相对位置时的输出性能, 接着, 基于组合式泵单元的试验结果进行芯片水冷系统的水冷效果研究。实验结果表明: 串联组合双泵工作时, 双泵位于串联组合首尾位置(AD)时性能较优, 在30 Hz时获得最大输出压力(25 kPa); 串联组合四泵工作时, 分别在35 Hz和55 Hz获得了最大压力(23.5 kPa)和最大流量(13.5 mL/min); 并联组合双泵工作时, 双泵都位于组合首位(AC)时性能较差; 并联组合四泵工作时, 分别在50 Hz和60 Hz获得最大输出流量(22 mL/min)和最大输出压力(12.6 kPa); 通过串并联以及泵工作数量的切换获得了芯片水冷系统的冷却效果, 不同的组合方式以及泵工作数量可以获得不同的冷却效果。获得了组合式压电驱动芯片水冷系统的驱动参数, 为计算机芯片有效散热提供一条新途径。

In order to improve the applicability, maintainability and the cooling efficiency of piezoelectric computer chip water cooling system, a computer chip water cooling system driven by combined piezoelectric pump was proposed. Initially, the output performance of the combined pump units in piezoelectric water-cooling system with different combinations (series/parallel), pump quantity and the relative position were tested and analyzed under 220 Vpp square wave. Subsequently, a research on water cooling efficiency of piezoelectric water-cooling system was conducted, based on the experimental results of combined pump units. The experimental results indicated that as the double pump units working in series combination, the performance of the working units located at the first and tail position (AD) was optimal with maximum output pressure (25 kPa) at a frequency of 30 Hz. When four pump units were working in series combination, the maximum pressure (23.5 kPa) and maximum flow (13.5 mL/min) were obtained at 35 Hz and 55 Hz, respectively. While double pump units were working in parallel combination, the performance of the double-working pumps which were located at the first (AC) position was relatively poor; When four pump units were working in parallel combination, the maximum output flow (22 mL/min) and maximum output pressure (12.6 kPa) were obtained at 50Hz and 60Hz, respectively, through switching of series/parallel and the pump quantity. It was found that different combinations and pump quantities could acquire different cooling efficiency. The driving parameters of the combined piezoelectric cooling system are obtained, which provide a novel approach for the effective cooling of computer chips.