准分子激光加工技术基于光化学机制。准分子激光具有波长短、重复频率高、单脉冲能量大、 输出光斑大 且能量分布均匀等特点,在精准和高效微加工领域有着独特的优势。准分子激光微加工可以减小热影响区(Heat affected zone, HAZ),有效避免产生裂纹等缺陷,在材料精细加工领域有很好的应用前景。介绍了准分子激光微加工的研究进 展,及准分子激光微加工应用于微电子集成电路封装、微机电系统(Micro-electro-mechanical system, MEMS)材料加工和生物医疗等领域的研究结果,总结了准分子激光微加工技术的发展趋势。

Excimer laser machining technology is based on photochemical mechanism. Excimer laser has the characteristics of short wavelength, high repetition rate, high single pulse energy, large output spot and uniform energy distribution. It has unique advantages in the field of precision and high efficiency microprocessing. Excimer laser micromachining can reduce the heat affected zone (HAZ) and effectively avoid cracks and other defects. It has a promising application prospect in the field of fine machining of materials. Research progress of excimer laser micromachining, and the application of excimer laser micromachining in the field of microelectronics integrated circuit packaging, micro-electro-mechanical system (MEMS) material processing and biological medicine are introduced. The development trend of excimer laser micromachining technology is summarized.