为了减少触摸屏生产过程中以及客户端触控不良的发生, 提高良率, 本文研究了IC绑定对触控与显示驱动器集成 (Touch and Display Driver Integration, TDDI)结构触控不良的影响。首先, 利用新思 IC厂商开发的容值测试软件进行测试, 根据测试结果确认触控不良的种类; 其次进行IC交叉验证, 根据测试结果确认显示屏还是IC存在问题。研究结果表明, 各向异性导电膜(Anisotropic Conductive Film, ACF)胶厚度较厚造成了IC绑定粒子变形小, 接触面积较小, 导致了较大的接触电阻, 出现触控不良。通过更换厚度较薄的ACF胶, 不良得到改善, 模组厂不良发生率从3.935×10-3 降低至8.38 ×10-4, 客户端不良率从1.5×10-3降低至0。通过变更ACF胶厚度, 改善IC绑定粒子状态, 可以有效减少触控不良的发生。

In order to reduce the occurrence of touch abnormal in the production process and client-side, improve the yield, the influence of IC bonding on touch abnormal of TDDI(Touch and Display Driver Integration) structure was studied in this paper. Firstly, Synaptics IC manufacturers capacitance testing results was used to identify the types of touch abnormal. Then, which had problems, the panel or IC was to be confirmed according to the IC cross validation results. The results show that the IC bonding particles have small deformation and contact area due to the ACF thickness, and it causes greater contact resistance and touch abnormal. The defect ratio is improved by replacing a thinner ACF, and it is decreased from 3.935×10-3 to 8.38 ×10-4 in module factory and decreased from 1.5×10-3 to 0 in customer. Improving the state of IC binding particles can effectively reduce the occurrence of TP fail by changing the thickness of ACF.