随着电子工业与能源科学的快速发展，热管理成为微电子、热逻辑器件和热电技术等多个领域关注的重要课题。以半导体产业为例，传统芯片散热技术难以满足功率密度日益增大的芯片散热需求，已经成为限制芯片集成度进一步提高的瓶颈。因此，热输运的研究重点从宏观尺度延伸至微观尺度，并要求人们对热输运机制有更深入理解。本文从热声子的扩散输运、弹道输运等微观机制出发，探讨了材料微结构与热输运之间的关系。实验和理论表明，晶体中各种微结构对热输运过程有着重要的调控作用。本文重点讨论了薄膜体系中的点缺陷与量子点、超晶格、异质结构界面等对热输运的调控作用，并对其中的热输运机制进行了简要分析。尽管各种复杂的器件结构对高效的热管理构成了挑战，但人工微结构也为热输运调控提供了新的机遇。

With the rapid advances of the electronics industry and energy science, thermal management has grown as a key issue to be addressed in multiple areas, including microelectronics, thermal logic devices and thermoelectric technologies. Especially in the semiconductor industry, the demand for thermal dissipation of the chips with ever growing power densities goes far beyond the capability even for the cutting-edge thermal management technologies, which turns out to be a bottleneck for further developments. Such issues call for more comprehensive understandings about thermal transport mechanisms, with extended research focuses on macroscale to microscale. In this review, we take the microstructures into account of thermal transport mechanisms, with the perspectives of diffusive and ballistic thermal transports. Various strategies are thus raised to engineer the thermal transport in the microstructures, as proved to be effective. In this review, focuses are set on point defect, quantum dot, superlattice and especially on interface engineering, in which the intrinsic thermal transport mechanisms are studied as well. With recent research progresses as a reference, it is evident that the rich synthetic material microstructures offer opportunities to strategies on thermal transport engineering. In spite of the challenges from complex device structures, corresponding explorations and studies are further needed.