中国激光, 2020, 47 (1): 0100001, 网络出版: 2020-01-09
激光剥离技术在柔性电子制造领域的应用研究进展 下载: 4377次
Application of Laser Lift-off Technique in Flexible Electronics Manufacturing
激光技术 激光材料加工 激光剥离 柔性电子 超快激光 laser technique laser material processing laser lift-off flexible electronics ultrafast laser
摘要
激光剥离技术通过脉冲激光辐照致材料烧蚀实现器件向终端基底的转移,具有一定的材料适用性和工艺兼容性,已成为近年来柔性电子器件制造的新兴关键技术。从激光剥离技术的基本机制和工艺特点出发,对激光剥离技术在不同柔性电子器件制造中的研究现状进行调研和介绍,重点阐述激光剥离技术应用中的新工艺与新理论。对激光剥离技术今后的发展方向,特别是超快激光在技术中的应用可能性进行了总结和展望。
Abstract
Laser lift-off (LLO) is a technique used to transfer devices to terminal substrates through the ablation of materials by pulsed laser irradiation. Recently, LLO has become the major technique for the fabrication of flexible electronic devices because of its wide material applicability and process compatibility. Further, the representative research achievements of LLO in case of the fabrication of flexible electronics are investigated and presented in this study with respect to the basic mechanisms and technological features, and novel theories and application techniques are given particular emphasis. Accordingly, the application prospects of the LLO technique, especially the possibility of ultrafast laser applications, are summarized and forecasted.
季凌飞, 马瑞, 张熙民, 孙正阳, 李鑫. 激光剥离技术在柔性电子制造领域的应用研究进展[J]. 中国激光, 2020, 47(1): 0100001. Lingfei Ji, Rui Ma, Ximin Zhang, Zhengyang Sun, Xin Li. Application of Laser Lift-off Technique in Flexible Electronics Manufacturing[J]. Chinese Journal of Lasers, 2020, 47(1): 0100001.