Mo/Si多层膜镀膜工艺是极紫外光刻的关键技术之一,为了优化并提升Mo/Si多层膜的镀膜工艺,研究了气压、靶-基底间距这两个工艺参数对Mo/Si多层膜表面粗糙度的影响。根据磁控溅射物理过程,建立了一个原子沉积的物理模型,分析了原子沉积到基底时的入射角度和入射能量分布对气压、靶-基底间距的影响。此外,利用直流磁控溅射镀膜机,制备了Mo/Si多层膜样片,并测量了膜表面粗糙度和功率谱密度,研究了膜表面粗糙度和功率谱密度随气压和靶-基底间距的演化规律。理论和实验的结论一致,所提模型从理论上解释了实验测量结果。

Mo/Si multilayer coating process is one of the key technologies for extreme ultraviolet lithography. In order to optimize the coating process of Mo/Si multilayers, we study the influences of environment pressure and target-substrate distance on the surface roughness of Mo/Si multilayer coating. A model of atomic deposition is established based on the physical process of magnetron sputtering. The variations of incident angle and the energy distribution of depositing atoms with environment pressure and target-substrate distance are investigated. Moreover, the experiments are performed to fabricate Mo/Si multilayer coating samples using a direct current magnetron sputtering coating machine, and the evolutions of the surface roughness and power spectral density with environment pressure and target-substrate distance are studied. The conclusion obtained from the model agrees well with that from the experiments, and the proposed model can provide a theoretical explanation for the results measured by the experiments.