金属材料水导激光加工实验研究

金属材料的激光加工目前正向着低表面粗糙度、小热影响区及大深径比结构的趋势发展。新近发展了一种基于激光-水射流耦合原理的水导激光加工技术, 本文阐述了水导激光加工技术的基本原理及其相对于传统激光加工方法的优势, 基于激光 -水射流耦合原理构建了一套水导激光加工设备, 对多种金属材料进行了水导激光加工实验。利用超景深显微镜对加工工件表面进行了观测与分析, 发现两种金属材料加工得到的盲孔边缘规则圆滑, 切槽的边缘平直无毛刺, 没有热影响区。实验结果说明对金属材料的水导激光精密加工具有可行性且有重要的应用价值。

Abstract

The development direction of metal material laser processing is to achieve small roughness, less heat-affected zone and high depth-diameter ratio. Recently, a kind of water-conducting laser processing technology based on laser water-jet coupling technology has been developed. The basic principle of water-conducting laser processing technology and its advantages over traditional laser processing methods are expounded. Based on the principle of laser water-jet coupling technology, a set of water-conducting laser processing equipment is constructed. The experiments of water-conducting laser processing for various metal materials are carried out. The surfaces of work piece are observed and analyzed by Leica DVM6 digital microscope. The edges of blind holes in two kinds of metal materials are regular and smooth, the edges of grooves are straight and without burrs, and there is no heat-affected zone in both materials. The results of experiments show that water-conducting laser processing tech-nology on metal precision machining is practical and has important application value.

参考文献

[1] Sun B Y, Qiao HC, Zhao J B, et al. Current status of water-jet guided laser cutting technology[J]. Opto-Electronic Engineering, 2017, 44(11): 1039.1044. 孙博宇, 乔红超, 赵吉宾, 等. 水导激光切割技术研究现状 [J].光电工程, 2017, 44(11): 1039–1044.

[2] Yang L J, Kong X J, Wang Y, et al. Laser micro-holes machining technology and its application[J]. Aeronautical Manufacturing Technology, 2016(19): 32–36. 杨立军, 孔宪俊, 王扬, 等. 激光微孔加工技术及应用 [J]. 航空制造技术, 2016(19): 32–36.

[3] Perrottet D, Housh R, Richerzhagen B, et al. Heat damage-free laser-microjet cutting achieves highest die fracture strength[J]. Proceedings of SPIE, 2005, 5713: 285–293.

[4] Wang H Z. The technology principle and application of wa-ter-jet-guided laser scribing[J]. Equipment For Electronic Products Manufacturing, 2008, 37(3): 27.31, 49.王宏智 . 微水导激光划片工艺原理及应用 [J]. 电子工业专用设备 , 2008, 37(3): 27–31, 49.

[5] Zhou Y H, Liao J H, Meng H Y, et al. Laser micro-fabrication of endovascular stent[J]. Applied Laser, 2005, 25(3): 161–164,154. 周永恒, 廖健宏 , 蒙红云, 等. 血管内支架的激光精细切割技术 [J].应用激光, 2005, 25(3): 161–164, 154.

[6] Richerzhagen B. Entwicklung und konstruktion eines systems zur uebertragung von laserenergie für die laserzahnbehan-dlung[D]. Lausanne: EPFL, 1994.

[7] Nilsson T, Wagner F, Housh R, et al. Scribing of GaN wafer for white LED by water-jet-guided laser[J]. Proceedings of SPIE, 2004, 5366: 200–206.

[8] Li L. Study on water-jet guided laser micromachining technol-ogy[D]. Harbin: Harbin Institute of Technology, 2008: 1–107. 李灵. 水导激光微细加工技术研究 [D]. 哈尔滨 : 哈尔滨工业大学 , 2008: 1–107.

[9] Ye R F, Shen Y, Wang L, et al. Novel coupling system of wa-ter-jet guided laser[J]. Journal of Xiamen University (Natural Science), 2009, 48(3): 369–372. 叶瑞芳, 沈阳, 王磊, 等. 新型水导引激光耦合系统研究 [J]. 厦门大学学报(自然科学版), 2009, 48(3): 369–372.

[10] Sun D, Wang J H, Han F Z. Research on coupling technology for water-jet guided laser machining based on off-axis optical system[J]. Infrared and Laser Engineering, 2018, 47(12): 1206001. 孙冬, 王军华, 韩福柱. 基于离轴光学系统的水导激光耦合技术研究[J].红外与激光工程, 2018, 47(12): 1206001.

[11] Adelmann B, Ngo C, Hellmann R. High aspect ratio cutting of metals using water jet guided laser[J]. The International Journal of Advanced Manufacturing Technology, 2015, 80(9–12): 2053–2060.

[12] Porter J A, Louhisalmi Y A, Karjalainen J A, et al. Cutting thin sheet metal with a water jet guided laser using various cutting distances, feed speeds and angles of incidence[J]. The Inter-national Journal of Advanced Manufacturing Technology, 2007, 33(9–10): 961–967.

[13] Couty P, Wagner F R, Hoffmann P W. Laser coupling with a multimode water-jet waveguide[J]. Optical Engineering, 2005, 44(6): 068001.

[14] Sun D, Wang J H, Han F Z. Contrastive study of water jet guided laser and water jet assisted laser cutting of Monocrys-talline silicon[J]. Applied Laser, 2016, 36(6): 723–727.孙冬, 王军华 , 韩福柱. 单晶硅水导 /水辅助激光切割加工对比研究[J].应用激光, 2016, 36(6): 723–727.

曹治赫, 乔红超, 赵吉宾. 金属材料水导激光加工实验研究[J]. 光电工程, 2020, 47(2): 190423. Cao Zhihe, Qiao Hongchao, Zhao Jibin. Experimental study on laser water-jet machining of metal material[J]. Opto-Electronic Engineering, 2020, 47(2): 190423.

金属材料水导激光加工实验研究

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