热成像系统图像处理电路的新进展

范永杰; 金伟其

光学技术, 2012, 38 (3): 362, 网络出版: 2012-05-24

热成像系统图像处理电路的新进展

Latest progress of IR image system processing electronic

论文大纲

范永杰 ^1,2,*金伟其 ²

作者单位

¹ 昆明理工大学理学院，昆明 650000

² 北京理工大学光电学院，光电成像技术与系统教育部重点实验室，北京 100081

热成像系统图像处理电路 thermal imager system processing electronics FPGA FPGA

摘要

国外一流热成像厂商均研制了适宜其产品应用的新型高性能图像处理电路。选取了5套具有代表性的国外高性能处理电路，对其硬件设计构架、实现功能、以及对外接口三方面进行了对比分析。这些高性能处理电路的主要特点有：电路功能分模拟转换和数字处理两部分；数字处理电路以大规模FPGA为处理核心，并配以大量存储器，且广泛应用FPGA中的嵌入式核；在具备基本使用功能的基础上，继续在非均匀校正以及图像增强两个方向，应用效果更佳的算法；处理电路通常具备扩展能力；处理图像分辨率大于等于640×512像素；模拟视频采用VGA接口等。

Abstract

Foreign first-class thermal imager manufacturers have developed new generation high-performance image processing electronics which are suitable for their products. A comparative analysis of hardware design architecture, functions and external interfaces is done for five representative sets of high-performance IR image processing electronics. Analysis shows: electronics is divided into analog processing part and digital processing part; a FPGA with plenty resource is used as a core processor, which associated with large memories, and embedded cores in the FPGA is widely used also; besides base image processing functions, better non-uniformity correction and image enhancement algorithms is applied to reinforce image performance; processing electronics usually have expansion capability and can deal with images which resolution is larger than or equal to 640×512 pixels; analog output is VGA; etc.

参考文献

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范永杰, 金伟其. 热成像系统图像处理电路的新进展[J]. 光学技术, 2012, 38(3): 362. FAN Yongjie, JIN Weiqi. Latest progress of IR image system processing electronic[J]. Optical Technique, 2012, 38(3): 362.

热成像系统图像处理电路的新进展

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