High-power vertical-cavity surface-emitting lasers bonded with efficient packaging

Changling Yan; Guoguang Lu; Li Qin

Chinese Optics Letters, 2010, 8 (6): 595, Published Online: Jun. 22, 2010

High-power vertical-cavity surface-emitting lasers bonded with efficient packaging Download： 618次

论文大纲

Changling Yan ¹Guoguang Lu ²Li Qin ²

Author Affiliations

¹ National Key Lab on High-Power Semiconductor Lasers, Changchun University of Science and Technology, Changchun 130022, China

² Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, China

Abstract

High-power vertical-cavity surface-emitting lasers (VCSELs) are processed using a wet thermal-selective oxidation technique. The VCSEL chips are packaged by employing three different bonding methods of silver solder, In-Sn solder, and metalized diamond heat spreader. After packaging, optical output power, wavelength shift, and thermal resistance of the devices are measured and compared in an experiment. The device packaged with a metalized diamond heat spreader shows the best operation characteristics among the three methods. The 200 \mu m-diameter device bonded with a metalized diamond heat spreader produces a continuous wave optical output power of 0.51 W and a corresponding power density of 1.6 kW/cm<sup>2</sup> at room temperature. The thermal resistance is as low as 10 K/W. The accelerated aging test is also carried out at high temperature under constant current mode. The device operates for more than 1000 h at 70 ℃, and the total degradation is only about 10%.

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Changling Yan, Guoguang Lu, Li Qin. High-power vertical-cavity surface-emitting lasers bonded with efficient packaging[J]. Chinese Optics Letters, 2010, 8(6): 595.

High-power vertical-cavity surface-emitting lasers bonded with efficient packaging Download： 618次

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