Chinese Optics Letters, 2018, 16 (9): 091301, Published Online: Sep. 6, 2018   

A pair of integrated optoelectronic transceiving chips for optical interconnects Download: 675次

Author Affiliations
State Key Laboratory of Information Photonics and Optical Communications, Beijing University of Posts and Telecommunications, Beijing 100876, China
Figures & Tables

Fig. 1. Transceiving chip’s structure.

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Fig. 2. Transceiving chip’s reflection spectra: (a) the chip that transmits light at a wavelength around 850 nm and receives light at a wavelength around 805 nm; (b) the chip that transmits light at a wavelength around 805 nm and receives light at a wavelength around 850 nm.

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Fig. 3. VCSEL unit’s static performance: (a) the chip that transmits light at a wavelength around 850 nm, where the simulated lasing wavelength is at 848.1 nm; (b) the chip that transmits light at a wavelength around 805 nm, where the simulated lasing wavelength is at 805.3 nm.

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Fig. 4. PIN-PD unit’s photo-response performance upon the VCSEL unit’s output light power: (a) the chip that transmits light at a wavelength of 848.1 nm; (b) the chip that transmits light at a wavelength of 805.3 nm.

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Fig. 5. Spectral photo-response performances of the integrated transceiving chips: (a) the chip that transmits light at a wavelength of 848.1 nm and receives light at a wavelength around 805 nm; (b) the chip that transmits light at a wavelength of 805.3 nm and receives light at a wavelength around 850 nm.

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Fig. 6. Photo-response performances of the integrated transceiving chips with the input light intensity changing from 0 to 1000W/cm2: (a) the chip that receives light at a wavelength of 805.3 nm; (b) the chip that receives light at a wavelength of 848.1 nm.

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Fig. 7. Electrical isolation performances of the integrated transceiving chips represented by the analysis of the S21 parameter: (a) the AC signal applied on the VCSEL electrode; (b) the AC signal applied on the PIN-PD electrode.

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Kai Liu, Huize Fan, Yongqing Huang, Xiaofeng Duan, Qi Wang, Xiaomin Ren, Qi Wei, Shiwei Cai. A pair of integrated optoelectronic transceiving chips for optical interconnects[J]. Chinese Optics Letters, 2018, 16(9): 091301.

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