红外与毫米波学报, 2009, 28 (3): 194, 网络出版: 2010-12-13   

HgCdTe探测器In焊凸点的失效及有限元分析

FAILURE AND FINITE ELEMENT ANALYSIS OF INDIUM SOLDER-BUMPS FOR HgCdTe DETECTORS
作者单位
1 宁波大学 信息科学与工程学院,浙江 宁波 315211
2 中国科学院上海技术物理研究所 传感技术国家重点实验室,上海 200083
摘要
卫星工作时,由斯特林机致冷的HgCdTe中长波红外探测器会经受从-173℃以下到常温的成千上万次温度 循环.由于不同材料的热膨胀系数(TEC)不匹配,这样就会造成电极封装的疲劳和失效,进而影响卫星的正常工 作.利用中科院上海技术物理研究所研制的温度循环设备TCE-a,模拟了真空环境下的斯特林制冷机的开关机模 式,发现了In焊凸点的两种失效模式.运用有限元方法,对In焊凸点的失效进行了力学分析.
Abstract
During satellite's working, HgCdTe mid or long wavelength infrared (IR) detectors cooled by the stirling cooler are subjected to thousands of repeated thermal cycles from below -173℃ to room temperature. Due to the mismatch of thermal expansion coefficients(TEC) of different materials, thermal cycles can cause the bonding's fatigue and failure, even cause the disfunction of satellites. By using the thermal cycle equipment (TCE-a) developed by SITP, the vaccum environment and stirling cooler's intermittent working modes were simulated, and two failure modes of indium solder-bump were discovered. And the finite elements method (FEM) was used to analyze the mechanism of bumps' failure.
参考文献

[1] SHAO Jun, MA Li-Li, L Xiang, et al. Recent progress and potential impact of modulation spectroscopy for narrowgap HgCdTe[J]. J. Infrared Millim. Waves (邵军,马丽 丽,吕翔,等.窄禁带碲镉汞调制光谱的近期进展和前 景. 红外与毫米波学报 ),2008, 27 (1):1—6.

[2] XU Xiang-Yan, YE Zhen-Hua, LI Zhi-Feng, et al. Numerical modling of middle wavelength two-color photovoltaic HgCdTe detectors[J]. J. Infrared Millim. Waves (徐向晏, 叶振华,李志峰,等.中波双色光伏型HgCdTe红外探测器 模拟研究. 红外与毫米波学报 ),2007, 26 (3):164—169.

[3] Yan Q, Rex L, Ghorbani H R, et al. Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints[J]. Microelectronics Reliability, 2006, 46 (2-4): 574—588.

[4] YAO Li-Zhen. Reliability Physics (姚立真. 可靠性物理. 电 子工业出版社),2004:322.

[5] LIANG Xue-Yi. Tailor method of thermal cycle screening profile[J]. Electronic Product Reliability and Environmental Testing (粱雪仪.温度循环筛选剖面的裁剪方法. 电子产 品可靠性与环境试验 ),2002, 25 (5):35—38.

[6] WU Li-Gang, LIU Da-Fu, ZHU San-Gen, et al. Novel thermal cycle screening equipment for cryogenic semiconductor components[J]. J. Infrared Millim. Waves (吴礼刚,刘大 福,朱三根,等.用于低温半导体器件筛选的新型温度循 环设备. 红外与毫米波学报 ),2006, 25 (2):153—156.

[7] Wu L G, Liu D F, Huang Y M, et al. A feasible thermal cycle screening system for cryogenic semiconductor components [J]. Proceedings of SPIE, 2004,5640, Beijing, November.

[8] Manual of Mechanical Engineering Metallography (机械工 程手册·物理金相卷)

[9] LI Zhong-Ya, CHENG Lei, LI Cheng-Fu. Study of Laser Damage of Silica and Sapphire Crystal[J]. Chinese Journal of Lasers (李仲伢,程雷,李成富.熔石英玻璃和白宝石晶 体激光损伤的研究. 中国激光 ),2002, A29 (10):920—924.

[10] LIU Yu-Dong, ZHANG Gang, CUI Jian-Guo, et al. Effects of texture on the shear strength of In bump[J]. J. Infrared Millim. Waves (刘豫东,张钢,崔建国,等.织构对铟凸点 剪切强度的影响. 红外与毫米波学报 ),2004, 23 (3): 225—228.

吴礼刚, 刘大福, 朱三根, 龚海梅. HgCdTe探测器In焊凸点的失效及有限元分析[J]. 红外与毫米波学报, 2009, 28(3): 194. WU Li-Gang, LIU Da-Fu, ZHU San-Gen, GONG Hai-Mei. FAILURE AND FINITE ELEMENT ANALYSIS OF INDIUM SOLDER-BUMPS FOR HgCdTe DETECTORS[J]. Journal of Infrared and Millimeter Waves, 2009, 28(3): 194.

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