热蒸镀法制备Z箍缩用铝镁合金箔材及其性能

刘旭东; 杨毅; 白黎; 杨波; 牛高; 余斌; 朱晔; 周秀文

doi:doi:10.11884/hplpb201628.022002

强激光与粒子束, 2016, 28 (2): 022002, 网络出版: 2016-03-24

热蒸镀法制备Z箍缩用铝镁合金箔材及其性能

Preparation and properties of AlMg alloy film by thermal evaporation for Z-pinch

论文大纲

刘旭东 ^*杨毅白黎杨波牛高余斌朱晔周秀文

作者单位

中国工程物理研究院激光聚变研究中心, 四川绵阳 621900

铝镁合金热蒸镀粗糙度带阵 Z箍缩 AlMg alloy thermal evaporation roughness ribbon array Z-pinch

摘要

厚度低于5 μm的AlMg合金箔材可作为带材切割的原材料应用于Z箍缩物理实验。利用热蒸镀方法，通过控制沉积速率在超光滑的NaCl基片上获得了AlMg薄膜，最终在脱膜后获得了厚度低于5 μm的无支撑AlMg箔材。实验对该箔材的厚度均匀性、表面粗糙度、衍射峰位、晶粒尺寸及距表面不同距离下的成份进行了分析表征。实验发现，此热蒸镀法制备的AlMg合金箔材的厚度均匀性优于8%，两面的表面粗糙度均小于180 nm，晶粒尺寸约20 nm; 不同厚度样品的衍射峰位未明显偏移，箔材内应力很小; 不同深度下Mg含量稳定分布，而在箔材表面杂质含量较高，在距表面6 nm以下合金含量达到预期值并趋于稳定。热蒸镀法制得的无支撑AlMg合金箔材具有厚度可控且均匀、成分稳定、内应力小的特点，适用于制备Z箍缩带阵负载。

Abstract

AlMg alloy films with a thickness less than 5 μm could be used as raw materials of precision cutting for ribbon array load in Z-pinch physics tests. In this paper, the thermal evaporation was used to prepare such ultrathin AlMg alloy films. By controlling the deposition rate of the thermal evaporation craft, AlMg alloy films with a thickness less than 5 μm were coated on super-smooth NaCl substrate and after subsequent process of NaCl substrate solution, unbraced AlMg alloy films were achieved. Thickness uniformity, surface roughness, diffraction peak site, crystal grain size and elements component with different distances to surface were measured. It was found that in such a thermal evaporation way, the thickness uniformity of AlMg alloy films was better than 8%, the surface roughness (Ra) of both sides of samples less than 180 nm, the crystal grain size less than 20 nm. It was showed that diffraction peak site of samples with different thickness hardly displaced in the common meaning of few internal stress. It was also showed that the content of Mg element under different depths was stable, the impurity content of film surface was higher than that in the center place, and an anticipative component could be achieved under 6 nm depth stably. Prepared by thermal evaporation, unbraced AlMg alloy films with the characteristics of controllable and uniform thickness, stable component and few internal stress were applicable for ribbon array load of Z-pinch.

参考文献

[1] Deeney C, Douglas M R, Spielman R B, et al. Enhancement of X-ray from a Z-pinch using nested-wire arrays［J］. Phys Rev Lett, 1998, 81(22):4883-4886.

[2] Hammer H J, Tabak M, Wilks C S, et al. High yield inertial confinement fusion target design for a Z-pinch-driven hohlraum［J］. Phys Plasmas, 1999, 6(5):2129-2136.

[3] 余斌，周秀文，朱晔，等.准球型负载装配技术［J］.强激光与粒子束, 2014, 26:102002.(Yu Bin, Zhou Xiuwen, Zhu Ye, et al. Assembly technology of quasi-spherical load. High Power Laser and Particle Beams, 2014, 26:102002)

[4] 牛高，杨毅，刘旭东，等.电磁箍缩铝带阵负载的研制［J］.强激光与粒子束, 2014, 26:072004.(Niu Gao, Yang Yi, Liu Xudong, et al. Preparing aluminum cingulum array load for Z-pinch. High Power Laser and Particle Beams, 2014, 26:072004)

[5] 刘德斌,邱龙会,付志兵,等.弹簧支撑自适应Z-pinch单层柱面丝阵负载研制［J］.强激光与粒子束, 2004, 16(8):1009-1012.(Liu Debin, Qiu Longhui, Fu Zhibing, et al. Method to fabricate self-adaptable cylindric wire-array load for Z-pinch physical experiments. High Power Laser and Particle Beams, 2004, 16(8):1009-1012)

[6] 魏芸,邱龙会,唐永建,等.Z-pinch靶的结构及材料特点［J］.强激光与粒子束, 2001, 13(5):568-572.(Wei Yun, Qiu Longhui, Tang Yongjian, et al. Characteristics of Z-pinch targets and related materials. High Power Laser and Particle Beams, 2001, 13(5):568-572)

[7] Li Zhenghong, Xu Rongkun, Chu Yanyun, et al. Experimental investigation of the ribbon-array ablation process［J］. Phys Plasmas, 2013, 20:032702.

[8] 李朝阳，谢军，吴卫东，等.多辊轧机冷轧技术在靶材料制备中的应用［J］.强激光与粒子束, 2006, 18(1):81-84.(Li Chaoyang, Xie Jun, Wu Weidong, et al. Application of multi-high cold-rolling mill in the target materials fabrication. High Power Laser and Particle Beams, 2006, 18(1):81-84)

[9] 吴占玲.磁控溅射法制备的Al-Mg-B薄膜的研究［D］.大连:大连理工大学, 2011:1-8.(Wu Zhanling. Study on properties of Al-Mg-B thin films prepared by magnetron sputtering. Dalian: Dalian University of Technology, 2011:1-8)

[10] 汪伟，卢柯.磁控溅射Cu/Al多层膜的固相反应［J］.金属学报, 2003, 39(1):1-4.(Wang Wei, Lu Ke. Solid state reaction for magnetron sputtering Cu/Al multilayers. Acta Metallurgica Sinica, 2003, 39(1):1-4)

[11] 雷洁红，段浩，邢丕峰,等.磁控溅射不同厚度铝薄膜的微结构及其表面形貌［J］.半导体光电, 2010, 31(6):888-894.(Lei Jiehong, Duan Hao, Xing Pifeng, et al. Microstructure and surface morphology of Al films prepared by magnetro sputtering. Semiconductor Optoelectronics, 2010, 31(6):888-894)

[12] Hafner M, Mardare A I, Hassel A W. Vapour phase co-deposition of Al-Cu thin film alloys［J］. Phys Status Solidi A, 2013, 210(5):1006-1012.

[13] Yang Qing, Sha Jian, Wang Lei, et al. MgO nanostructures synthesized by thermal evaportation［J］. Materials Science and Egineering C, 2006, 26:1097-1101.

[14] Yang Pengfei, Yao Manwen, Xiao Ruihua, et al. Preparation of Al2O3 film by sol-gel method on thermally evaporated Al film［J］. Vacuum, 2014, 107:112-115.

刘旭东, 杨毅, 白黎, 杨波, 牛高, 余斌, 朱晔, 周秀文. 热蒸镀法制备Z箍缩用铝镁合金箔材及其性能[J]. 强激光与粒子束, 2016, 28(2): 022002. Liu Xudong, Yang Yi, Bai Li, Yang Bo, Niu Gao, Yu Bin, Zhu Ye, Zhou Xiuwen. Preparation and properties of AlMg alloy film by thermal evaporation for Z-pinch[J]. High Power Laser and Particle Beams, 2016, 28(2): 022002.

热蒸镀法制备Z箍缩用铝镁合金箔材及其性能

关于本站 Cookie 的使用提示

全站搜索

热蒸镀法制备Z箍缩用铝镁合金箔材及其性能

相关论文

相关资讯

关于本站 Cookie 的使用提示

全站搜索