中国激光, 2021, 48 (8): 0802014, 网络出版: 2021-04-13
Ag-Pd纳米合金低温连接及其抗电化学迁移性能 
下载： 1189次
Low-Temperature Bonding of Ag-Pd Nanoalloy and Its Resistance to Electrochemical-Migration
图 & 表
图 1. 纳米合金的制备及接头截面示意图。(a)脉冲激光沉积制备纳米合金;(b)SiC与DBC基板封装接头截面
Fig. 1. Schematic illustration of nanoalloy preparation and joint cross-section. (a) Pulsed laser deposition of nanoalloy; (b) cross-section of SiC and DBC substrate joint
图 2. 沉积态Ag-10%Pd纳米合金薄膜。(a)Ag-10%Pd纳米合金薄膜;(b)Ag-10%Pd纳米合金的高倍形貌;(c)合金颗粒中银元素的分布;(d)合金颗粒中钯元素的分布
Fig. 2. As-deposited Ag-10%Pd nanoalloy film. (a) Ag-10%Pd nanoalloy film; (b) high magnification of Ag-10%Pd nanoalloy; (c) element distribution of Ag in nanoalloy; (d) element distribution of Pd in nanoalloy
图 3. Ag-10%Pd纳米合金颗粒的尺寸分布。(a)数量分布;(b)体积比
Fig. 3. Size distribution of Ag-10%Pd nanoalloy particles. (a) Number distribution; (b) volume ratio
图 4. Ag-10%Pd纳米合金烧结接头及接头中的元素分布(烧结温度为300 ℃)。(a)接头的宏观形貌;(b)元素线扫描
Fig. 4. Sintered joint using Ag-10%Pd nanoalloy and elements distribution in the joint (sintering temperature of 300 ℃). (a) Macro morphology of joint; (b) elements distribution by line scanning
图 5. 典型Ag-10%Pd纳米合金烧结层的微观组织及元素分布(烧结温度为300 ℃)。(a)烧结层的微观组织;(b)银元素分布;(c)钯元素分布
Fig. 5. Typical microstructures and element distribution of Ag-10%Pd sintered layer (sintering temperature of 300 ℃). (a) Microstructure of Ag-Pd sintered layer; (b) Ag distribution; (c) Pd distribution
图 7. 典型纳米合金烧结接头的断口形貌(烧结温度为300 ℃)。(a)断口的宏观形貌;(b)断口局部放大
Fig. 7. Typical fracture surface of nanoalloy sintered joint (sintering temperature of 300 ℃). (a) Macro morphology of fracture surface; (b) high magnification of fracture surface
图 8. Ag-10%Pd纳米合金与纯银的短路电流随时间的变化
Fig. 8. Short-circuit current variation with time for Ag-10%Pd nanoalloy and pure Ag
贾强, 王文淦, 阿占文, 邓钟炀, 冯斌, 刘磊. Ag-Pd纳米合金低温连接及其抗电化学迁移性能[J]. 中国激光, 2021, 48(8): 0802014. Qiang Jia, Wengan Wang, Zhanwen A, Zhongyang Deng, Bin Feng, Lei Liu. Low-Temperature Bonding of Ag-Pd Nanoalloy and Its Resistance to Electrochemical-Migration[J]. Chinese Journal of Lasers, 2021, 48(8): 0802014.
PDF全文
