[1] ALWAIDH A, SHARP M, FRENCH P．Laser processing of rigid and flexible PCBs［J］．Optics and Lasers in Engineering, 2014, 58(7): 109-113．

[2] 尹旭巍．国内印刷电路板技术发展态势分析［J］．黑龙江科技信息, 2013(4): 73．

    YIN XUWEI．The developing situation analysis of printed circuit board domestically［J］．Heilongjiang Science and Technology Information, 2013(4): 73．

[3] 李祥友, 曾晓雁．激光柔性布线技术的现状和展望［J］．激光技术, 2005, 29(4): 373-376．

    LI XIANGYOU, ZEN XIAOYAN．Status and prospect of conductive line fabrication by laser technology［J］．Laser Technology, 2005, 29(4): 373-376.

[4] KIM J, CHOI H．Flexible printed circuit boards laser bonding using a laser beam homogenization process［J］．Optics and Lasers in Engineering, 2012, 50(11): 1643-1653．

[5] 张菲, 曾晓雁, 李祥友, 等．355 nm和1064 nm全固态激光器刻蚀印刷线路板［J］．中国激光, 2008, 35(10): 1637-1643．

    ZHANG FEI, ZENG XIAOYAN, LI XIANGYOU, et al．Laser etching and cutting printed circuit board by 355 nm and 1 064 nm diode pumped solid state lasers［J］．Chinese Journal of Lasers, 2008, 35(10): 1637-1643．

[6] 余小飞, 何为, 王守绪, 等．紫外光激光加工盲孔的工艺研究［J］．印制电路信息, 2011(4): 62-66．

    YU XIAOFEI, HE WEI, WANG SHOUXU, et al．Research on blind via drilling using UV laser［J］．Printed Circuit Information, 2011(4): 62-66．

[7] 高胜淼, 闫珂柱, 韩培高, 等. 飞秒激光诱导硅材料表面周期结构的研究［J］．激光技术, 2015, 39(3): 395-398．.

    GAO SHENMIAO, YAN KEZHU, HAN PEIGAO, et al．Study on periodic structures on Si surface induced by femtosecond laser［J］．Laser Technology, 2015, 39(3): 395-398．

[8] 王延深, 王波, 董申, 等．高能量飞秒激光脉冲对硅和玻璃的附带损伤［J］．中国机械工程学报, 2006, 42(s1): 44-47．

    WANG YANSHEN, WANG BO, DONG SHEN, et al．High-energy femtosecond laser induced collateral damages on silicon and glass［J］．Chinese Journal of Mechanical Engineering, 2006, 42(s1): 44-47.

[9] 张志刚．飞秒激光技术［M］．北京: 科学出版社, 2017: 438-446．

    ZHANG ZHIGANG.Femtosecond laser technology［M］.Beijing: Science Press, 2017: 438-446．

[10] 孙晓慧, 周常河, 余昺鲲．飞秒激光加工最新进展［J］．激光与光电子学进展, 2004, 41(9): 37-45．

    SUN XIAOHUI, ZHOU CHANGHR, YU BINGKUN．The latest development of femtosecond laser processing［J］．Laser & Optoelectronics Progress, 2004, 41(9): 37-45.

[11] GORODETSKY G, KAZYAKA T G, MELCHER R L, et al．Calorimetric and acoustic study of ultraviolet laser ablation of polymers［J］．Appl. Phys. Let., 1985, 46(9): 828-830．

[12] COLE H S, LIU H S, PHILIPP H R. Dependence of photoetching rates of polymers at 193 nm on optical absorption depth［J］．Appl. Phys. Let., 1986, 48(1): 76-77．

[13] 王文君．飞秒激光金属加工中的形状及形貌控制研究［D］．西安: 西安交通大学, 2008．

    WANG WENJUN．Study of shape and morphology control in femtosecond laser fabrication of metals［D］．Xian: Xian Jiaotong University, 2008.

[14] 傅茜, 张菲, 蒋明, 等．1 064 nm和355 nm激光扫描刻蚀覆铜板工艺及质量研究［J］．激光技术, 2014, 38(4): 435-440．

    FU XI, ZHANG FEI, JIANG MING, et al．Study on technology and quality of etching copper clad laminate with 1 064 nm and 355 nm laser［J］．2014, 38(4): 435-440．

[15] RYTLEWSKI P, MROZ W, ZENKIEWICZ M, et al．Laser induced surface modification of polylactide ［J］．Journal of Materials Processing Technology, 2012, 212(8): 1700-1704．