1 河南工业大学材料科学与工程学院, 郑州 450001
2 中国科学院宁波材料技术与工程研究所, 海洋材料及相关技术重点实验室, 浙江省海洋材料与防护技术重点实验室, 宁波 315201
单晶金刚石具有超宽的禁带宽度、低的介电常数、高的击穿电压、高的热导率、高的本征电子和空穴迁移率,以及优越的抗辐射性能, 是目前已知的最有前景的宽禁带高温半导体材料, 被誉为“终极半导体”。但单晶金刚石在半导体上的大规模应用还有很多技术难题急需解决。本文聚焦大尺寸(英寸级)单晶金刚石衬底的化学气相沉积合成、剥离切片及研磨抛光技术, 通过对近年来的相关文献进行整理, 综述了相关方面的国内外研究现状。在此基础上, 对未来单晶金刚石半导体材料的制备、剥离和研磨抛光进行了展望。
单晶金刚石 大尺寸 沉积 剥离 研磨抛光 半导体 single crystal diamond large size deposition lift-off grinding and polishing semiconductor
1 厦门大学航空航天学院，福建 厦门 361005
2 厦门大学深圳研究院，广东 深圳 518057
Overview: Driven by the rapid development of national optical projects such as laser nuclear fusion and aerospace telescopes, as well as high-end civilian fields such as advanced instruments and optical lenses, the requirements for full-frequency domain processing errors and surfaces of optical components are becoming more and more stringent. At this stage, the optical components generally need to go through rough grinding, fine grinding, polishing and coating, and other processes, and their surface quality mainly depends on the defect removal ability and error control level of the polishing process. Whether the fine grinding process can obtain better surface shape accuracy and low surface/subsurface damage suppression determines the processing efficiency, and the ultra-precision processing manufacturing equipment is the premise of the realization of ultra-precision machining of the optical components. So far, all countries in the world have invested in the research and development of optical ultra-precision grinding and polishing technology, and have developed more relatively mature high-precision grinding and polishing equipment, which can better meet the processing needs of most of the current optical components. For the core equipment and key technologies required for ultra-precision manufacturing, China has long relied on imports. In order to break through the bottleneck restricting the development of ultra-precision technology in China at this stage, under the traction and drive of the national large-scale engineering project, China has made remarkable progress in optical ultra-precision manufacturing equipment and technology. However, for the optical ultra-precision technology and equipment, there is still a certain gap between China and the international advanced level, and it is necessary to continue to strengthen the research. In addition to the high-end grinding and polishing equipment necessary for the ultra-precision machining of optical components, it is also necessary to strengthen the technical level of a series of key supporting units, such as ultra-precision grinding and polishing processing technology, high-end key functional components, intelligent monitoring technology of processing environment, efficient ultra-precision machining tools, processing and inspection path planning and compensation processing strategies, computer-aided manufacturing and testing software, etc. The research, development, and application of these technologies are related to the development of high-end manufacturing in the civilian fields and national defense fields, and are also the focus of the country. This paper mainly focuses on the ultra-precision machining of large-diameter optical aspherical components. Starting from the grinding and polishing process route, this paper introduces the long-term research progress of the Precision Engineering Laboratory of Xiamen University in the field of large-diameter optical aspherical component processing, and introduces in detail the technical and system achievements such as ultra-precision grinding and polishing equipment, robot-assisted grinding and polishing, equipment intelligent monitoring system, processing technology and control software.
超精密加工 磨抛装备 加工工艺 CAM软件 ultra-precision machining grinding and polishing equipment processing technology CAM software
北京石油化工学院新材料与化工学院, 北京 102617
采用磁控溅射法在ITO玻璃上制备了CdZnTe薄膜, 探究机械磨抛对CdZnTe薄膜阻变特性的影响。通过对XRD图谱、Raman光谱、AFM显微照片等实验结果分析阐明了机械磨抛影响CdZnTe薄膜阻变特性的物理机制。研究结果表明, 磁控溅射制备的薄膜为闪锌矿结构, F43m空间群。机械磨抛提高了CdZnTe薄膜的结晶质量; CdZnTe薄膜粗糙度(Ra)由磨抛前的3.42 nm下降至磨抛后的1.73 nm; 磨抛后CdZnTe薄膜透过率和162 cm-1处的类CdTe声子峰振动峰增强; CdZnTe薄膜的阻变开关比由磨抛前的1.2增加到磨抛后的4.9。机械磨抛提高CdZnTe薄膜质量及阻变特性的原因可能是CdZnTe薄膜在磨抛过程中发生了再结晶。
磁控溅射 机械磨抛 粗糙度 表面缺陷 阻变特性 再结晶 CdZnTe CdZnTe magnetron sputtering mechanical grinding and polishing roughness surface defect resistive switching characteristic recrystallization
1 华侨大学制造工程研究院，厦门 361021
2 苏州赛尔特新材料有限公司，苏州 215127
金刚石因其优异的物理性质被视为下一代半导体材料，然而其极高的硬度、脆性和耐腐蚀性导致其加工困难，尤其是对于大尺寸的化学气相沉积(chemical vapor deposition, CVD)单晶金刚石(SCD)晶片而言，目前还缺乏一种高效、低成本的磨抛加工方法。本文提出一种基于工件自旋转的同心双砂轮磨抛一体化加工技术，在一次装夹中，先采用金刚石磨料的陶瓷内圈砂轮磨削单晶金刚石晶片表面，将单晶金刚石表面迅速平坦化，后采用金刚石与CuO混合磨料的外圈溶胶-凝胶(sol-gel,SG)抛光轮抛光单晶金刚石晶片表面，使其在较短时间内完成从原始生长面(Sa约46 nm)到原子级表面精度(Sa＜0.3 nm)的加工。磨削加工中，硬质金刚石磨料的陶瓷砂轮高速划擦金刚石晶片表面，在强机械作用下获得较大的材料去除以及纳米级的光滑单晶金刚石表面，同时引起进一步的表面非晶化；SG抛光加工中，硬质金刚石磨料高速划擦单晶金刚石表面形成高温高压环境，进一步诱导CuO粉末与单晶金刚石表面的非晶碳发生氧化还原反应，实现反应抛光。磨抛一体化的加工技术为晶圆级的单晶、多晶金刚石的工业化生产提供借鉴。
CVD单晶金刚石 磨抛一体化 反应抛光 粗糙度 陶瓷砂轮 SG轮 CVD single crystal diamond integration technology of grinding and polishing reactive polishing roughness ceramic grinding wheel SG wheel
重庆三峡学院智能信息处理与控制重点实验室, 重庆 404100
为实现对微小位移的精确测量,提高位移精度,提出了基于表面等离子体共振的微位移光纤传感器。利用渐变折射率多模光纤中光束的传播角度随入射光位置的变化而变化的特性,结合表面等离子体共振传感器的共振波长对共振角度变化具有很高灵敏度的特性,实现对微小位移的精确测量。为满足共振条件,将渐变折射率多模光纤研磨成具有合适角度的楔形,精确控制渐变折射率多模光纤的长度,并将光纤探针浸入到一定折射率的液体中。通过630 nm单模光纤将白光光源从渐变折射率多模光纤的端面耦合到光纤探针中,搭建位移平台,精确控制单模光纤和渐变折射率多模光纤的径向相对位置,通过光谱仪检测共振波长随相对位置的变化规律。实验结果表明:当光纤研磨角度为12°,且液体折射率为1.350时,该传感器具有高达10.32 nm·μm
-1的灵敏度,位移分辨率高达1.9 nm。
光纤光学 微小位移测量 表面等离子体共振 渐变折射率多模光纤 光纤研磨技术 激光与光电子学进展
2018, 55(4): 040606
1 四川大学制造科学与工程学院，四川 成都 610065
2 中国科学院光电技术研究所，四川 成都 610209
在非球面及自由曲面加工中，应用最为成熟的是计算机控制光学表面成型(CCOS)技术。现有CCOS 技术普遍采用恒压力研抛方法，加工过程中研抛压力保持恒压，通过控制驻留时间实现所需的去除量。本文研究了基于变压力的CCOS研抛方法，增加了调控维度，通过同时控制研抛压力和驻留时间实现所需的去除量。首先，对该方法建立了加工控制的数学模型。然后，测量分析了磨头输出力的稳定性和响应速度，去除函数的稳定性。最终，在K9 材料平面镜上开展了正弦压力抛光的材料去除实验。结果表明，实测与理想正弦研抛压力周期一致，力误差标准差约为0.35N，对去除面形PV和RMS的影响均不到9%；实际与仿真加工的面形轮廓周期一致，加工区域的面形误差在17%以内。本文实现了变压力研抛，验证了基于变压力的CCOS研抛方法在光学加工中的有效性。
光学加工 变压力 研抛 optical processing CCOS CCOS variable pressure grinding and polishing
解放军理工大学气象海洋学院, 江苏 南京 211101
在分析比较传统光纤探针研制工艺特点的基础上认为其不适用于蓝宝石光纤,因此提出了基于研磨抛光系统的光纤探针制备工艺。介绍了研磨系统的组成及运作方式,阐述了光纤探针制备过程中研磨抛光与固化的主要流程。最后使用光学仿真软件Zemax进行了光纤探针传输效率的仿真测试,仿真结果表明采用940 nm波段光源及“面对面”探头安置方式时光纤探针传输效率最高。可应用于蓝宝石光纤探针传感器系统的搭建。
光纤探针 制备工艺 研磨法 Zemax光学仿真 传光测试 optical fiber probe preparation technology grinding and polishing technology optical simulation made by Zemax light transmitting test
介绍了热释电探测器 PZT晶片制备工艺及选择锆钛酸铅（ PZT）陶瓷材料制作敏感元的理论依据，阐述了晶片磨抛理论，对磨抛质量影响因素进行了细致分析。对比了几种抛光液对晶片表面的抛光效果，并进行了扫描电镜和表面粗糙度分析，得到了抛光后晶片表面的扫描电子显微镜（SEM）照片和晶片表面形态，确定了最佳抛光材料。通过理论和实践的结合，研制出了完全能满足器件工艺要求的热释电探测器晶片。
热释电探测器 锆钛酸铅（PZT）材料 PZT晶片 研磨抛光 pyroelectric detector PZT PZT wafer grinding and polishing
