半导体光电, 2014, 35 (5): 843, 网络出版: 2014-10-23
高温老化条件下LED模组封装材料失效研究
Failure Analysis of Packaging Materials of LED Modules under High Temperature Aging Test
引用该论文
聂磊, 项雯婧, 李婳婧, 黄飞. 高温老化条件下LED模组封装材料失效研究[J]. 半导体光电, 2014, 35(5): 843.
NIE Lei, XIANG Wenjing, LI Huajing, HUANG Fei. Failure Analysis of Packaging Materials of LED Modules under High Temperature Aging Test[J]. Semiconductor Optoelectronics, 2014, 35(5): 843.
聂磊, 项雯婧, 李婳婧, 黄飞. 高温老化条件下LED模组封装材料失效研究[J]. 半导体光电, 2014, 35(5): 843. NIE Lei, XIANG Wenjing, LI Huajing, HUANG Fei. Failure Analysis of Packaging Materials of LED Modules under High Temperature Aging Test[J]. Semiconductor Optoelectronics, 2014, 35(5): 843.