激光与光电子学进展, 2018, 55 (3): 030008, 网络出版: 2018-09-10
大口径非球面元件磨削轮廓测量技术研究进展 
下载： 1480次
Research Progress of Measurement Technology for Large-Diameter Aspheric Elements on Grinding Stage
引用该论文
席建普, 李彬, 任东旭, 赵则祥. 大口径非球面元件磨削轮廓测量技术研究进展[J]. 激光与光电子学进展, 2018, 55(3): 030008.
Jianpu Xi, Bin Li, Dongxu Ren, Zexiang Zhao. Research Progress of Measurement Technology for Large-Diameter Aspheric Elements on Grinding Stage[J]. Laser & Optoelectronics Progress, 2018, 55(3): 030008.
席建普, 李彬, 任东旭, 赵则祥. 大口径非球面元件磨削轮廓测量技术研究进展[J]. 激光与光电子学进展, 2018, 55(3): 030008. Jianpu Xi, Bin Li, Dongxu Ren, Zexiang Zhao. Research Progress of Measurement Technology for Large-Diameter Aspheric Elements on Grinding Stage[J]. Laser & Optoelectronics Progress, 2018, 55(3): 030008.
PDF全文
