激光与光电子学进展, 2018, 55 (3): 030008, 网络出版: 2018-09-10   

大口径非球面元件磨削轮廓测量技术研究进展 下载: 1482次

Research Progress of Measurement Technology for Large-Diameter Aspheric Elements on Grinding Stage
作者单位
中原工学院机电学院, 河南 郑州 450007
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席建普, 李彬, 任东旭, 赵则祥. 大口径非球面元件磨削轮廓测量技术研究进展[J]. 激光与光电子学进展, 2018, 55(3): 030008.

Jianpu Xi, Bin Li, Dongxu Ren, Zexiang Zhao. Research Progress of Measurement Technology for Large-Diameter Aspheric Elements on Grinding Stage[J]. Laser & Optoelectronics Progress, 2018, 55(3): 030008.

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席建普, 李彬, 任东旭, 赵则祥. 大口径非球面元件磨削轮廓测量技术研究进展[J]. 激光与光电子学进展, 2018, 55(3): 030008. Jianpu Xi, Bin Li, Dongxu Ren, Zexiang Zhao. Research Progress of Measurement Technology for Large-Diameter Aspheric Elements on Grinding Stage[J]. Laser & Optoelectronics Progress, 2018, 55(3): 030008.

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