PC微流控芯片黏接筋与溶剂的协同辅助键合
[1] 林秉承,秦建华.图解微流控芯片实验室[M].北京:科学出版社,2008.
LIN B CH,QIN J H.Graphic Laboratory on a Microfluidic Chip[M].Beijing:Science Press,2008.(in Chinese)
[2] 孟伟东,孙丽存,李强,等.基于PDMS基片的可变焦柱透镜[J].中国光学,2013,6(3):365-370.
[3] 李明宇,薛 懿,罗 根,等.平面光波导生物传感器微流通道的不可逆封合[J].中国光学,2013,6(1):103-110.
[4] LEE B S,LEE Y U,KIM H S,et al..Fully integrated lab-on-a-disc for simultaneous analysis of biochemistry and immunoassay from whole blood[J].Lab on a Chip,2011,11(1):70-78.
[5] BURGER R,KIRBY D,GLYNN M,et al..Centrifugal microfluidics for cell analysis[J].Chemical Biology,2012,16:409-414.
[6] STROHMEIER O,EMPERLE A,ROTH G,et al..Centrifugal gas-phase transition magnetophoresis(GTM)-a generic method for automation of magnetic bead based assays on the centrifugal microfluidic platform and application to DNA purification [J] Lab on a Chip,2013,13:146-155.
[7] 邓永波,张平,杜新,等.亲/疏水性不同壁面组成微通道的深宽比与通道内液体的自发毛细流动[J].光学精密工程,2010,18(7):1562-1567.
[8] 罗怡,张苗苗,孙屹博,等.面向聚合物微器件超声波精密封接的阵列波导能结构[J].光学精密工程,2011,19(4):754-761.
[9] 徐征,王继章,杨铎,等.辅助溶剂对PMMA微流控芯片模内键合的影响[J].光学精密工程,2012,20(2):321-328.
[10] WANG X D,JIN J,LI X,et al..Low-pressure thermal bonding[J].Microelectronic Engineering,2011,88:2427-2430.
[11] CHO W W Y,LEI K,SHI G,et al..Microfluidic channel fabrication by PDMS-interface bonding[J].Smart Materials and Structures,2006,15:S112-S116.
[12] 张宗波.聚合物微流控芯片超声波键合机理与方法研究[D].大连:大连理工大学博士论文,2010.
ZHANG Z B.Study on the Mechanism and Methods of Ultrasonic Bonding for Polymer Microfluidic Chips[D].Dalian:Dalian University of Technology,2010.(in Chinese)
[13] KOESDJOIO M T,TENNICO Y H,REMCHO V T.Fabrication of a microfluidic system for capillary electrophoresis using a two-stage embossing technique and solvent welding on poly(methylmethacrylate) with water as a sacrificial layer[J].Anal.Chem,2008,80(7):2311-2318.
[14] UMBRECHT F,MLLER D,GATTIKER F,et al..Solvent assisted bonding of polymethylmethacrylate:Characterization using the response surface methodology[J].Sensors and Actuators A:Physical,2009,156:121-128.
[15] 严志云,石虹桥,梁世强,等.聚合物复合材料界面粘合理论研究进展[J].仲恺农业技术学院学报,2007,20(2):62-65.
YAN ZH Y,SHI H Q,LIANG SH Q,et al..Progressof study on the interfacial adhesion of polymer composites[J].Journal of Zhong kai University of Agriculture andTechnology,2007,20(2):62-65.(in Chinese)
[16] NG S H,TJEUNG R T,WANG Z F,et al..Thermally activated solvent bonding of polymer[J].Microsyst Technol.,2008,14:753-759.
[17] 高保娇.溶解度参数及其应用[J].山西化工,1998(2):18-19.
GAO B Q.Application for solubility parameters[J].Shanxi Chemical Industry,1998(2):18-19.(in Chinese)
[18] TSAO C W,DEVOE D L.Bonding of thermoplastic polymer microfluidics[J].Microfluid Nanofluid,2009,6:1-16.
范建华, 邓永波, 宣明, 刘永顺, 武俊峰, 吴一辉. PC微流控芯片黏接筋与溶剂的协同辅助键合[J]. 光学 精密工程, 2015, 23(3): 708. FAN Jian-hua, DENG Yong-bo, XUAN Ming, LIU Yong-shun, WU Jun-feng, WU Yi-hui. Synergistic bonding process of solvent and tendon for PC-based microfluidic chips[J]. Optics and Precision Engineering, 2015, 23(3): 708.