[1] 赫尔齐克. 微光学元件、系统和应用[M]. 北京: 国防工业出版社, 2002.

    HERZIG H P. Micro-Optics Elements, Systems and Applications[M]. Beijing: China National Defense Industry Press,2001. (in Chinese)

[2] 佟军民, 胡松, 李爱敏,等. 衍射光学元件在无掩模光刻中的应用[J]. 微细加工技术, 2006, 10(5): 18-23.

    TONG J M, HU S, LI A M, et al.. Application of diffractive optical elements in maskless lithography[J]. Microfabrication Technology, 2006,10(5): 18-23. (in Chinese)

[3] 仇中军, 周立波, 房丰洲. 石英玻璃的化学机械磨削加工[J]. 光学 精密工程, 2010, 18(7): 1554-1561.

    QIU ZH J, ZHOU L B, FANG F ZH, et al.. Chemical mechanical grinding for quartz glass[J]. Opt. Precision Eng., 2010,18(7): 1554-1561. (in Chinese)

[4] 沈易, 吴翌旭, 邢燕冰,等. 多光束无掩模光刻系统[J]. 应用光学, 2010,31(4): 537-539.

    SHEN Y, WU Y X, XING Y B, et al.. Multi-beam maskless lithograph system[J]. Journal of Applied Optics,2010,31(4): 537-539. (in Chinese)

[5] EHRHARDT M, RACIUKAITIS G, GECYS P, et al.. Laser-induced backside wet etching of fluoride and sapphire using picosecond laser pulses[J]. Appl. Phys. A, 2010,101: 399-404.

[6] ZIMMER K,BHME R, EHRHARDT M, et al.. Mechanism of backside etching of transparent materials with nanosecond UV-lasers [J]. Appl. Phys. A, 2010,101: 405-410.

[7] BHME R, PISSADAKIS S, EHRHARDT M, et al.. Backside etching of fused silica with ultra-short laser pulses at the interface to absorbing liquid [J]. Journal of Physics: Conference Series, 2007,59: 173-176.

[8] HOPP B, VASS C, SMAUSZ T. Laser induced backside dry etching of transparent materials [J]. Applied Surface Science, 2007,253: 7922-7925.

[9] ZIMMER K, BHME R, VASS C, et al.. Time-resolved measurements during backside dry etching of fused silica [J]. Applied Surface Science, 2009(25): 9617-9621.

[10] ZIMMER K,BHME R, RAUSCHENBACH B. Laser etching of fused silica using an adsorbed toluene layer [J]. Appl. Phys. A, 2004,79: 1883-1885.

[11] SMAUSZ T, CSIZMADIA T, KRESZ N, et al.. Influence on the laser induced backside dry etching of thickness and material of the absorber, laser spot size and multipulse irradiation [J]. Applied Surface Science, 2007,254: 1091-1095.

[12] YENA M H, HUANG C W, HSU W C. Crack-free micromachining on glass substrates by visible LIBWE using liquid metallic absorbers [J]. Applied Surface Science, 2010,257: 87-92.

[13] EHRHARDT M, RACIUKAITIS G, GECYS P, et al.. Microstructuring of fused silica by laser-induced backside wet etching using picosecond laser pulses [J]. Applied Surface Science, 2010,256: 7222-7227.

[14] LEE T, JANG D, AHN D, et al.. Effect of liquid environment on laser-induced backside wet etching of fused silica [J]. J. Appl. Phys., 2010,107: 033-112.

[15] ZIMMER K, BHME R, RUTHE D, et al.. Backside laser etching of fused silica using liquid gallium[J]. Appl. Phys. A, 2006,84: 455-458.

[16] BANKS D P, KAUR K S, EASON R W. Etching and forward transfer of fused silica in solid-phase by femtosecondlaser-induced solid etching (LISE)[J]. Applied Surface Science, 2009,255: 8343-8351.

[17] HOPO B, SMAUSZ T, VASS C, et al.. Laser-induced backside dry and wet etching of transparent materials using solid and molten tin as absorbers [J]. Appl. Phys. A, 2009,94: 899-904.

[18] 单明广, 钟志, 郭黎利, 等. 用于无模光刻的连续浮雕谐衍射透镜阵列设计[J]. 光学 精密工程, 2010,18(1): 9-14.

    SHAN M G, ZHONG ZH, GUO L L. Design of continuous-relief harmonic diffractive microlens array for maskless lithography[J]. Opt. Precision Eng., 2010,18(1): 9-14. (in Chinese)

[19] HUANG Z Q, HONG M H, DO T B M, et al.. Laser etching of glass substrates by 1 064 nm laser irradiation [J]. Appl. Phys. A, 2008,93: 159-163.

[20] BONSE J, WROBEL J M, KRGER J, et al.. Ultrashort-pulse laser ablation of indium phosphide in air [J]. Applied Physics A-Materials Science & Processing, 2001,72: 89-92.