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[2] Elson J, Bennett J. Calculation of the power spectral density from surface profile data［J］. Applied Optics, 1995, 34(1): 201-208.

[3] 程晓锋，郑万国，蒋晓东，等. 用功率谱密度坍陷评价光学元件波前中频误差特性［J］. 强激光与粒子束， 2005，17(10): 1465-1468.(Chen Xiaofeng, Zheng Wanguo, Jiang Xiaodong, et al. Evaluating intermediate frequency error property of wavefront of optical components with PSD collapse. High Power Laser and Particle Beams, 2005, 17(10): 1465-1468)

[4] 许乔，顾元元，柴林，等. 大口径光学元件波前功率谱密度检测［J］. 光学学报，2001，21(3): 344-347.(Xu Qiao, Gu Yuanyuan, Chai Lin, et al. Measurement of wavefront power spectral density of large optical components. Acta Optica Sinica，2001, 21(3): 344-347)

[5] 陈伟，姚汉民，伍凡，等. 用于圆形口径光学元件的功率谱密度检测［J］. 红外与激光工程， 2006，35(s2): 97-100.(Chen Wei, Yao Hanmin, Wu Fan, et al. Power spectral density measurement for circular optical surfaces. Infrared and laser engineering, 2006, 35(s2): 97-100)

[6] 杨炜，郭隐彪，许乔，等. 超精抛光中边缘效应对材料去除量的影响［J］. 强激光与粒子束， 2008， 20(10): 1654-1657.(Yan Wei, Guo Yinbiao, Xu Qiao, et al. Edge effects on material removal amount in ultra-precise polishing process. High Power Laser and Particle Beams, 2008, 20(10): 1654-1657)

[7] 曹冲，冯国英，杨李茗，等.影响超精密环抛相对磨削量因素的计算模拟［J］.光电工程，2004，31(4): 67-71.(Cao Chong. Feng Guoying, Yang Liming, et al. Calculation and simulation for the factors affecting relative grinding removal in ultra-precision continuous polishing. Opto-Electronic Engineering, 2004, 31(4): 67-71)

[8] Suratwala T, Feit M, Steele W. Material removal and surface figure during pad polishing of fused silica［J］. Journal of American Ceramic Society,2010,93(5): 1326-1340.

[9] 谢瑞清，李亚国，王健.光学加工中抛光垫特征对工件面形的影响分析［J］.光电工程，2010，37(7): 64-69.(Xie Ruiqing, Li Yaguo, Wang Jian. The effect of characteristic of pad on surface form of optical flats in polishing. Opto-Electronic Engineering 2010, 37(7): 64-69)

[10] ISO10110. Optics and optical instruments—preparation of drawings for optical and systems, Part 8: surface texture［S］.